Patents by Inventor Fumiya MAEDA

Fumiya MAEDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240166507
    Abstract: A hydrogen-oxidizing bacteria culturing method includes: a hydrogen generating step of generating hydrogen by bringing a metal body into contact with a liquid containing water and causing a corrosion reaction in the metal body; and a hydrogen supplying step of supplying the generated hydrogen to a medium inoculated with hydrogen-oxidizing bacteria.
    Type: Application
    Filed: October 13, 2023
    Publication date: May 23, 2024
    Inventors: Yasutoshi HIDESHIMA, Naoko TOMITA, Fumiya MAEDA
  • Publication number: 20240091851
    Abstract: A thixomolding material includes: a metal body that contains Mg as a main component; and a coating portion that is adhered to a surface of the metal body via a binder and contains SiC particles containing SiC as a main component. A mass fraction of the SiC particles in a total mass of the metal body and the SiC particles is 2.0 mass % or more and 40.0 mass % or less. The binder may contain waxes. A content of the binder may be 0.001 mass % or more and 0.200 mass % or less.
    Type: Application
    Filed: November 24, 2023
    Publication date: March 21, 2024
    Inventors: Shunsuke UCHIZONO, Setsuya IWASHITA, Yasutoshi HIDESHIMA, Fumiya MAEDA, Koichi OZAKI, Tadao FUKUTA
  • Patent number: 11878345
    Abstract: A thixomolding material includes: a metal body that contains Mg as a main component; and a coating portion that is adhered to a surface of the metal body via a binder and contains SiC particles containing SiC as a main component. A mass fraction of the SiC particles in a total mass of the metal body and the SiC particles is 2.0 mass % or more and 40.0 mass % or less. The binder may contain waxes. A content of the binder may be 0.001 mass % or more and 0.200 mass % or less.
    Type: Grant
    Filed: March 25, 2022
    Date of Patent: January 23, 2024
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Shunsuke Uchizono, Setsuya Iwashita, Yasutoshi Hideshima, Fumiya Maeda, Koichi Ozaki, Tadao Fukuta
  • Publication number: 20230201915
    Abstract: A thixomolding material includes: a metal body containing magnesium(Mg) as a primary component; a plurality of coating particles provided at a front surface of the metal body and having an average particle diameter equal to or less than 100 ?m, the plurality of coating particles being made of an inorganic material differing from the metal body; and an interposed particle interposed between the metal body and the coating particles and having an average particle diameter smaller than the coating particle, the interposed particle being made of an inorganic oxide.
    Type: Application
    Filed: December 27, 2022
    Publication date: June 29, 2023
    Inventors: Shunsuke UCHIZONO, Yasutoshi HIDESHIMA, Setsuya IWASHITA, Tetsuhiko TAKEUCHI, Fumiya MAEDA
  • Publication number: 20220316035
    Abstract: A thixomolding material includes: a metal body that contains Mg as a main component; and a coating portion that is adhered to a surface of the metal body via a binder and contains SiO2 particles containing SiO2 as a main component. An average particle diameter of the SiO2 particles is less than 20.0 ?m, and a mass fraction of the SiO2 particles in a total mass of the metal body and the SiO2 particles is 1.0 mass % or more and 40.0 mass % or less. The binder may contain waxes. A content of the binder may be 0.001 mass % or more and 0.200 mass % or less.
    Type: Application
    Filed: March 25, 2022
    Publication date: October 6, 2022
    Inventors: Fumiya MAEDA, Yasutoshi HIDESHIMA, Setsuya IWASHITA, Shunsuke UCHIZONO, Koichi OZAKI, Tadao FUKUTA
  • Publication number: 20220316070
    Abstract: A thixomolding material includes: a metal body that contains Mg as a main component; and a coating portion that is adhered to a surface of the metal body via a binder and contains Si particles containing Si as a main component. An average particle diameter of the Si particles is 1 ?m or more and 100 ?m or less, and a mass fraction of the Si particles in a total mass of the metal body and the Si particles is 1.0 mass % or more and 30.0 mass % or less. The binder may contain waxes. A content of the binder may be 0.001 mass % or more and 0.200 mass % or less.
    Type: Application
    Filed: March 25, 2022
    Publication date: October 6, 2022
    Inventors: Fumiya MAEDA, Yasutoshi HIDESHIMA, Setsuya IWASHITA, Shunsuke UCHIZONO, Koichi OZAKI, Tadao FUKUTA
  • Publication number: 20220314315
    Abstract: A thixomolding material includes: a metal body that contains Mg as a main component; and a coating portion that is adhered to a surface of the metal body via a binder and contains SiC particles containing SiC as a main component. A mass fraction of the SiC particles in a total mass of the metal body and the SiC particles is 2.0 mass % or more and 40.0 mass % or less. The binder may contain waxes. A content of the binder may be 0.001 mass % or more and 0.200 mass % or less.
    Type: Application
    Filed: March 25, 2022
    Publication date: October 6, 2022
    Inventors: Shunsuke UCHIZONO, Setsuya IWASHITA, Yasutoshi HIDESHIMA, Fumiya MAEDA, Koichi OZAKI, Tadao FUKUTA
  • Publication number: 20220314314
    Abstract: A thixomolding material includes: a metal body that contains Mg as a main component; and a coating portion that is adhered to a surface of the metal body via a binder and contains C particles containing C as a main component. A mass fraction of the C particles in a total mass of the metal body and the C particles is 5.0 mass % or more and 40.0 mass % or less. The binder may contain waxes. The C particles may be graphite particles.
    Type: Application
    Filed: March 25, 2022
    Publication date: October 6, 2022
    Inventors: Yasutoshi HIDESHIMA, Setsuya IWASHITA, Fumiya MAEDA, Shunsuke UCHIZONO, Koichi OZAKI, Tadao FUKUTA