Abstract: A thixomolding material includes: a metal body that contains Mg as a main component; and a coating portion that is adhered to a surface of the metal body via a binder and contains SiC particles containing SiC as a main component. A mass fraction of the SiC particles in a total mass of the metal body and the SiC particles is 2.0 mass % or more and 40.0 mass % or less. The binder may contain waxes. A content of the binder may be 0.001 mass % or more and 0.200 mass % or less.

Abstract: A semiconductor device includes a first pad, a second pad, a first output driver provided for the first pad and configured to output a first transmission signal to the first pad, a second output driver provided for the second pad and configured to output a second transmission signal to the second pad, a register that stores first and second calibration values, a first reference resistor for the first pad and having a resistance value that is set according to the first calibration value, a second reference resistor for the second pad and having a resistance value that is set according to the second calibration value, a first setting circuit configured to calibrate a resistance value of the first output driver using the first reference resistor, and a second setting circuit configured to calibrate a resistance value of the second output driver using the second reference resistor.

Abstract: A semiconductor memory device includes an output pin configured for connection with a memory controller, an output circuit configured to output through the output pin a voltage signal that changes over time in accordance with one or more bits of data to be output to the memory controller, and a control circuit configured to temporarily change a drive capability of the output circuit each time a voltage signal corresponding to one bit of the data is output through the output pin.

Abstract: A resol-type para-octylphenol-formaldehyde co-condensation resin and a method for producing the same are provided, the resol-type para-octylphenol-formaldehyde co-condensation resin having a content of a para-octylphenol monomer of 1 wt. % or less, having a total content of an aliphatic hydrocarbon, a halogenated aliphatic hydrocarbon, an aromatic hydrocarbon, a halogenated aromatic hydrocarbon, and an alcohol having 1 to 8 carbon atoms of 1 wt. % or less, the aliphatic hydrocarbon, the halogenated aliphatic hydrocarbon, the aromatic hydrocarbon, the halogenated aromatic hydrocarbon, and the alcohol having a boiling point of 60° C. or more, having a softening point of 70 to 105° C., and having an acid value of 20 to 28 KOHmg/g. The resol-type para-octylphenol-formaldehyde co-condensation resin can be used as a resin cross-linking agent for a rubber.

Abstract: A resol-type para-octylphenol-formaldehyde co-condensation resin and a method for producing the same are provided, the resol-type para-octylphenol-formaldehyde co-condensation resin having a content of a para-octylphenol monomer of 1 wt. % or less, having a total content of an aliphatic hydrocarbon, a halogenated aliphatic hydrocarbon, an aromatic hydrocarbon, a halogenated aromatic hydrocarbon, and an alcohol having 1 to 8 carbon atoms of 1 wt. % or less, the aliphatic hydrocarbon, the halogenated aliphatic hydrocarbon, the aromatic hydrocarbon, the halogenated aromatic hydrocarbon, and the alcohol having a boiling point of 60° C. or more, having a softening point of 70 to 105° C., and having an acid value of 20 to 28 KOHmg/g. The resol-type para-octylphenol-formaldehyde co-condensation resin can be used as a resin cross-linking agent for a rubber.