Abstract: An inner housing part has through-holes for connecting first lead pins (power supply terminal, output terminal, ground terminal) with the connector pins. The inner housing part has grooves that house second lead pins for adjusting output signals of a sensor chip. Three of the grooves each has a shape in which a distance between opposing sides of the groove is less than a diameter of the second lead pin that corresponds to the groove. The inner housing part is fixed to a case by a thermoset adhesive so as to house lead pins arranged in the case included in a sensor element. The second lead pins are fitted in the grooves, suppressing lifting of the inner housing part during curing of the adhesive.

Abstract: A first connector pin to a third connector pin have a substantially L-shaped cross-sectional shape formed by a horizontal part embedded in the top of an inner housing part by resin molding and a vertical part continuous with and protruding upwardly orthogonal to the horizontal part. A fourth connector pin has a substantially I-shaped cross-sectional shape having only the vertical part. The horizontal part of the first connector pin is provided so as to surround the first end of the first connector pin, the horizontal part and the first end of the second connector pin, the horizontal part and the first end of the third connector pin, and is integrated and connected to the fourth connector pin. A chip capacitor is attached to the connector pins by a joining member. Thus, the connector pins are connected to each other via the chip capacitors.

Abstract: An inner housing part has through-holes for connecting first lead pins (power supply terminal, output terminal, ground terminal) with the connector pins. The inner housing part has grooves that house second lead pins for adjusting output signals of a sensor chip. Three of the grooves each has a shape in which a distance between opposing sides of the groove is less than a diameter of the second lead pin that corresponds to the groove. The inner housing part is fixed to a case by a thermoset adhesive so as to house lead pins arranged in the case included in a sensor element. The second lead pins are fitted in the grooves, suppressing lifting of the inner housing part during curing of the adhesive.

Abstract: A first connector pin to a third connector pin have a substantially L-shaped cross-sectional shape formed by a horizontal part embedded in the top of an inner housing part by resin molding and a vertical part continuous with and protruding upwardly orthogonal to the horizontal part. A fourth connector pin has a substantially I-shaped cross-sectional shape having only the vertical part. The horizontal part of the first connector pin is provided so as to surround the first end of the first connector pin, the horizontal part and the first end of the second connector pin, the horizontal part and the first end of the third connector pin, and is integrated and connected to the fourth connector pin. A chip capacitor is attached to the connector pins by a joining member. Thus, the connector pins are connected to each other via the chip capacitors.