Abstract: A substrate and semiconductor chips are connected by solder bumps and a vacant space around the solder bumps is coated with resin in such a degree that the tops of the semiconductor chips are not coated therewith. Epoxy resin or a resin having a smaller thermal expansion coefficient than the epoxy resin is used in the resin coating, and an inorganic material having a smaller thermal expansion coefficient than said resin is mixed therein.

Abstract: A multilayer printed circuit board having a plurality of printed circuit boards each having opposite surfaces respectively provided with an electric source or ground layer and a signal circuit layer. The plurality of printed circuit boards is stacked through adhesive layers such that the electric source or ground layer and the signal circuit layer are alternately disposed, the characteristic impedance of each signal circuit layer is given by a thickness and material of each of the substrate and the adhesive sheet disposed between the signal circuit layer and one of two electric source or ground layers adjacent to the signal circuit layer and between the same signal circuit layer and the other electric source or ground layer.

Abstract: A cooling system for an electronic apparatus comprises a plurality of mother boards each having a circuit board to be cooled, a blower for causing an air flow from one of the mother boards to the other, and a draft duct for directing the air flow between the mother boards.The draft duct includes an inlet for dividing the air flow into a plurality of partial flows, a partition for changing an air flow direction of the partial flows into some other directions, and an outlet for intermixing the partial flows.

Abstract: An airtight packaging apparatus for covering with a cap a multichip module having LSI chips mounted on a ceramic substrate and for sealing the cap and substrate by means of solder includes a receptacle for accommodating the multichip module, valves for supplying gas to the receptacle and exhausting the receptacle, a retainer for holding the cap and adjusting the positional relation with respect to the multichip module, and a heater for heating solder of the junction between the multichip module and the cap. After solder has been heated and melted, the multichip module and the cap are sealed to each other.

Abstract: A semiconductor resin package structure formed according to the flip-chip connection method and permitting to cool the rear surface of semiconductor chips, comprising semiconductor chip and carrier substrate which is soldered on one surface thereof to electrodes of the semiconductor chip according to the flip-chip connection method, the gap between the semiconductor chip and the carrier substrate being filled with resin having a thermal expansion coefficient, which is approximately equal to that of used solder, the electrodes of the semiconductor chip being electrically connected with terminals on the other surface of the carrier substrate through the soldered portions and a through-hole conductor disposed on the carrier substrate, the thermal expansion coefficient of the carrier substrate being approximately equal to that of a multi-layer substrate, with which the substrate is connected by soldering with the terminals.

Abstract: A telephone cradle mount comprises a mounting member for mounting a telephone cradle and a fixing member, each of the mounting and fixing members comprises a generally rectangular mounting plate section, a first and second stationary bearing sections each provided on and perpendicularly to the mounting plate section and extending along, one of first opposite sides of the mounting plate section and one of second opposite sides whicha are perpendicular to the first opposite sides, the first and second stationary bearing sections being provided with a first and a second opening, respectively, and a rotatable bearing section having a third opening and rotatable such that the third opening selectively becomes aligned with the first and second openings.

Abstract: A cooling device for providing cooling of integrated circuit semiconductor chips is so arranged as to transfer a heat via thin fin members which are fitted with each other with a small clearance. The bottom surface of one of thermal conductive members which is provided integrally with the fin members is made greater in surface area than a back planar surface of the semiconductor chip, and the thermal conductive member and the semiconductor chip are kept at all times in plane contact with each other, thereby enhancing the cooling performance.

Abstract: An electric component part has its lead terminals bent in thickness directions in a middle section thereof at least two positions so that a step section virtually in parallel to the bottom of a circuit substrate is formed with the intention of absorbing the external force applied to the part by chaging the shape of the lead terminals. Increase in the part layout area due to the formation of the horizontal step section can be avoided, when necessary, by shifting the terminal lead out position on the component part inward thereby to minimize the jetty dimensions.

Abstract: In a cooling structure for electronic apparatus in which cards consisting of electronic components mounted on circuit boards are arranged in parallel on a motherboard. A pressure adjustment device with holes is arranged in a cooling air flow passage of each card. The area of the holes is selected in relation to the pressure loss characteristics of the related card based upon average air-flow sectional area.

Abstract: A power supply construction comprises a logic circuit section housed in a frame, a power supply section mounted rotatably on the frame in opposed to the logic circuit section for supplying power to the logic circuit section. Relay bars with an end arranged in the vicinity of the rotating axis of the power supply section are provided for supplying power to the logic circuit section. Power supply bars with an end arranged in the vicinity of the rotating axis are for outputting the voltages from the power supply section. In addition, a flexible conductor is provided for electrically connecting the relay bar and the power supply bar in such a manner that the power supply section is rotatable.

Abstract: A semiconductor device with a semiconductor element encased in a hollow ceramic package. The portion of the package at which the semiconductor element is disposed is formed from SiC admixed with Be or a compound of Be.

Abstract: A heat-conducting cooling module for cooling a semiconductor substrate in an integrated circuit package assembly in which a semiconductor substrate is mounted on a base board by small solder pellets, and which contains a single substrate or laminated substrates. A heat-conducting relay member is provided between the semiconductor substrate and a housing so as to be pressed onto the semiconductor substrate. At least either one of the housing or the heat-conducting relay member is made of a sintered product which includes silicon carbide as a chief component.

Abstract: The multi-layer ceramic substrate of this invention includes conductor layers and insulating layers disposed between the conductor layers. The insulating layers include the layers of a sintered body principally composed of mullite and the layers of a sintered body principally composed of alumina. This multi-layer ceramic substrate is produced by laminating the green sheets and sintering the laminate. The green sheets principally composed of mullite and the green sheet principally composed of alumina are prepared, and they are laminated and sintered.

Abstract: In a multilayer printed circuit board including a signal layer, a power supply layer, and through-holes, the shape of each of clearances formed on a power supply layer for the purpose of attaining insulation from through-holes is nearly a quadrangle having four circular corners. Thereby, the area of the power supply layer left between adjacent clearances is increased to suppress increase in electrical resistance at that portion.

Abstract: A cooling module for integrated circuit chips comprising a plurality of integrated circuit chips mounted on a wiring substrate, cooling members respectively provided for integrated circuit chips, each of the cooling members having therein space for circulating the coolant, and flexible pipes connected to respective cooling members, the coolant being caused to flow into or out of said space of said cooling member through the flexible pipes in order to remove heat from the integrated circuit chip.

Abstract: This invention provides a thermal fatigue resistant, low-melting point solder alloy consisting of 13 to 20% by weight Bi, 42 to 50% by weight, Pb, the balance being Sn. This solder alloy is suited for lap joints of electronic parts into or onto a printed substrate or a hybrid substrate.