Patents by Inventor Fumiyuki Komiyama

Fumiyuki Komiyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor module, molding apparatus, and molding method
    Patent number: 8900933
    Abstract: A semiconductor module includes a plurality of semiconductor elements, a first tabular electrode coupled to one face side of the plurality of semiconductor elements, a second tabular electrode coupled to the other face side of the plurality of semiconductor elements, and a molding material that encapsulates the plurality of semiconductor elements between the first electrode and the second electrode. A protrusion extending toward the second electrode is provided in a circumferential edge portion of the first electrode, and the protrusion surrounds the molding material.
    Type: Grant
    Filed: November 10, 2011
    Date of Patent: December 2, 2014
    Assignee: Nissan Motor Co., Ltd.
    Inventors: Shuuji Adachi, Fumiyuki Komiyama, Shuuji Kobayashi
  • SEMICONDUCTOR MODULE, MOLDING APPARATUS, AND MOLDING METHOD
    Publication number: 20130178018
    Abstract: A semiconductor module includes a plurality of semiconductor elements, a first tabular electrode coupled to one face side of the plurality of semiconductor elements, a second tabular electrode coupled to the other face side of the plurality of semiconductor elements, and a molding material that encapsulates the plurality of semiconductor elements between the first electrode and the second electrode. A protrusion extending toward the second electrode is provided in a circumferential edge portion of the first electrode, and the protrusion surrounds the molding material.
    Type: Application
    Filed: November 10, 2011
    Publication date: July 11, 2013
    Applicant: NISSAN MOTOR CO., LTD.
    Inventors: Shuuji Adachi, Fumiyuki Komiyama, Shuuji Kobayashi