Patents by Inventor Funaki Keisuke

Funaki Keisuke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Styrene polymer molding material and process for preparing same
    Patent number: 5183871
    Abstract: Disclosed are a styrene polymer molding material which has a high degree of syndiotacticity, a weight average molecular weight of 50,000 or more, and at least one melting points of 285.degree. C. or higher, and a process for producing the same by melting a styrene polymer having a high degree of syndioacticity and then molding it under a stress of 1.times.10.sup.6 dyne/cm.sup.2 or higher.The styrene polymer molding material of the present invention has excellent heat resistance. In addition, according to the process of the present invention, the above polymer molding material having excellent heat resistance can be prepared by a simple operation, and thus has marked advantages for practical use.
    Type: Grant
    Filed: May 14, 1990
    Date of Patent: February 2, 1993
    Assignee: Idemitsu Kosan Co., Ltd.
    Inventors: Komei Yamasaki, Funaki Keisuke