Abstract: A BGA package is disclosed including a base IC structure having a base substrate, with an opening running length-wise there through. A first semiconductor chip is mounted face-down on the base substrate so the bond pads thereof are accessible through the opening. The package also includes a secondary IC structure including a secondary substrate, having an opening running there through, and a second semiconductor chip. The second chip is mounted face-down on the secondary substrate so that the bond pads thereof are accessible through the opening in the secondary substrate. An encapsulant fills the opening in the secondary substrate and forms a substantially planar surface over the underside of the secondary substrate. The substantially planar surface is mounted to the first chip of the base IC structure through an adhesive. Wires connect a conductive portion of the secondary IC structure to a conductive portion of the base IC structure.

Abstract: A type of multilayered glove consisting of an inner layer, an outer layer, and pigments between the layers is disclosed. The layers can be made of the same or different materials to incorporate desired barrier properties such as oil or chemical resistance to a glove. The layers can also be made of the same or different colors. The glove can have the same physical barrier protection as wearing two gloves, but without the discomfort of wearing two gloves. The glove enhances barrier protection and allows users to detect any breach of the outer layer during the surgical procedure, which enables the user to execute corrective actions before cross contamination occurs.

Abstract: A method for creating an image on an image plane utilizing a photomask comprised of a plurality of intersecting subresolution features. Energy created by an energy source is projected through the subresolution features which diffract the light to produce constructive or positive interference thereby resulting in an image being formed on the image plane that is different than the image or pattern of subresolution features on the photomask.