Patents by Inventor Fung U. Lam

Fung U. Lam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Overheat-resistant power cord and method
    Patent number: 9787083
    Abstract: An overheat-protection device with a cord that includes a transmission wire to transmit electrical power and a sensor wire to transmit a signal, a plug attached to an end of the cord, and a thermistor includable in the plug and connected to the sensor wire. The signal may be received and/or analyzed by a sensing device, which may control a switching device to open and/or close a power circuit. The thermistor may detect a level of heat, which may be communicated as a signal via the sensor wires. The signal may be definable by the thermistor varying a level of resistance to the signal responsive to the level of detected heat. The thermistor may be a NTC thermistor and may be constructed from a thermal plastic or a ceramic.
    Type: Grant
    Filed: December 6, 2012
    Date of Patent: October 10, 2017
    Assignee: Twin-Star International, Inc.
    Inventors: Fung U Lam, Yong Wu, Matthew Crowe
  • Overheat-Resistant Power Cord and Method
    Publication number: 20140160611
    Abstract: An overheat-protection device with a cord that includes a transmission wire to transmit electrical power and a sensor wire to transmit a signal, a plug attached to an end of the cord, and a thermistor includable in the plug and connected to the sensor wire. The signal may be received and/or analyzed by a sensing device, which may control a switching device to open and/or close a power circuit. The thermistor may detect a level of heat, which may be communicated as a signal via the sensor wires. The signal may be definable by the thermistor varying a level of resistance to the signal responsive to the level of detected heat. The thermistor may be a NTC thermistor and may be constructed from a thermal plastic or a ceramic.
    Type: Application
    Filed: December 6, 2012
    Publication date: June 12, 2014
    Inventors: Fung U. Lam, Yong Wu, Matthew Crowe