Abstract: A method for cleaning semiconductor substrate without damaging patterned structure on the semiconductor substrate using ultra/mega sonic device comprises applying liquid into a space between a substrate and an ultra/mega sonic device; setting an ultra/mega sonic power supply at frequency f1 and power P1 to drive the ultra/mega sonic device; before bubble cavitation in the liquid damaging patterned structure on the substrate, setting the ultra/mega sonic power supply at zero output; after temperature inside bubble cooling down to a set temperature, setting the ultra/mega sonic power supply at frequency f1 and power P1 again; detecting power on time at power P1 and frequency f1 and power off time separately or detecting amplitude of each waveform output by the ultra/mega sonic power supply; comparing the detected power on time with a preset time ?1, or comparing the detected power off time with a preset time ?2, or comparing detected amplitude of each waveform with a preset value, if the detected power on time

Abstract: A method for cleaning semiconductor wafer includes putting at least one wafer on a cassette bracket in a first cleaning tank filled with chemical solution; after said wafers have been processed in the first cleaning tank, transferring the wafers from the first cleaning tank to a second cleaning tank with the wafers immersing in the chemical solution; and after said wafers have been processed in the second cleaning tank, taking the wafers out of the second cleaning tank.

Abstract: The present invention provides a substrate supporting apparatus having a spin chuck and a plurality of locating pins. The spin chuck configured to support and rotate a substrate has a supporting surface. The locating pins are disposed at the periphery of the supporting surface for limiting the substrate horizontal displacement. The supporting surface defines a first annular region. The first annular region is divided into a plurality of pin regions and a plurality of non-pin regions. The pin regions and the non-pin regions are arranged alternatively in a circumferential direction of the first annular region. Each of the pin regions is corresponding to one locating pin. A plurality of Bernoulli holes are set in the first annular region and is configured as an uneven structure in the first annular region so as to supply stronger gas flow in the pin regions than in the non-pin regions.

Abstract: A series-parallel monorail hoist based on an oil-electric hybrid power and a controlling method thereof. The monorail hoist includes a cabin, a hydraulic driving system, a lifting beam, a gear track driving and energy storage system, and a speed adaptive control system connected in series with each other and travelling on a track. The monorail hoist is capable of implementing an independent drive by an electric motor or a diesel engine in an endurance mode, a hybrid drive of the electric motor and the diesel engine in a transportation mode, and a hybrid drive of the diesel engine and a flywheel energy storage system in a climbing mode, according to different operating conditions that include conditions of an upslope, a downslope and a load. Power requirements for the monorail hoist under various operating conditions are satisfied, and the excess energy is recovered during the process of travelling.

Abstract: The present invention provides a high temperature chemical solution supply system for cleaning substrates. The system includes a solution tank, a buffer tank, a first pump and a second pump. The solution tank contains high temperature chemical solution. The buffer tank has a tank body, a vent line and a needle valve. The tank body contains the high temperature chemical solution. An end of the vent line connects to the tank body, and the other end of the vent line connects to the solution tank. The needle valve is mounted on the vent line, wherein the needle valve is adjusted to reach a flow rate to vent gas bubbles inside of the high temperature chemical solution out of the buffer tank through the vent line. An inlet of the first pump connects to the solution tank, and an outlet of the first pump connects to the buffer tank. An inlet of the second pump connects to the buffer tank, and an outlet of the second pump connects to a cleaning chamber in which a substrate is cleaned.

Abstract: The present invention provides a method for cleaning substrates comprising the steps of: placing a substrate on a substrate holder; implementing a bubble less or bubble-free pre-wetting process for the substrate; and implementing an ultra/mega sonic cleaning process for cleaning the substrate.

Abstract: A system for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the system comprising: a wafer holder for temporary restraining a semiconductor wafer during a cleaning process; an inlet for delivering a cleaning liquid over a surface of the semiconductor wafer; a sonic generator configured to alternately operate at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, to impart sonic energy to the cleaning liquid, the first predetermined period of time and the second predetermined period of time consecutively following one another; and a controller programmed to provide the cleaning parameters, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.

Abstract: The present disclosure provides a multi-exposure image fusion (MEF) method based on a feature distribution weight of a multi-exposure image, including: performing color space transformation (CST) on an image, determining a luminance distribution weight of the image, determining an exposure distribution weight of the image, determining a local gradient weight of the image, determining a final weight, and determining a fused image. The present disclosure combines the luminance distribution weight of the image, the exposure distribution weight of the image and the local gradient weight of the image to obtain the final weight, and fuses the input image and the weight with the existing pyramid-based multi-resolution fusion method to obtain the fused image, thereby solving the technical problem that an existing MEF method does not consider the overall feature distribution of the multi-exposure image.

Abstract: The present disclosure provides a multi-exposure image fusion (MEF) method based on a feature distribution weight of a multi-exposure image, including: performing color space transformation (CST) on an image, determining a luminance distribution weight of the image, determining an exposure distribution weight of the image, determining a local gradient weight of the image, determining a final weight, and determining a fused image. The present disclosure combines the luminance distribution weight of the image, the exposure distribution weight of the image and the local gradient weight of the image to obtain the final weight, and fuses the input image and the weight with the existing pyramid-based multi-resolution fusion method to obtain the fused image, thereby solving the technical problem that an existing MEF method does not consider the overall feature distribution of the multi-exposure image.

Abstract: The present disclosure provides a method and a device for detecting and evaluating a defect with electromagnetic multi-field coupling. The method includes magnetizing a pipeline with the electromagnetic multi-field coupling; detecting a defect of the pipeline along an axial direction of the pipeline at a constant speed; collecting signals at a position of the defect to obtain magnetic leakage signals in three dimensions and an electrical impedance signal; pre-processing the collected signals; decoupling the pre-processed signals, to obtain decoupled magnetic leakage signals and a decoupled electrical impedance signal; performing impedance analysis on the decoupled electrical impedance signal, and determining a type of the defect based on a phase angle of the decoupled electrical impedance signal; and performing quantification analysis on the decoupled magnetic leakage signals and performing quantification evaluation on a size of the defect using a neural network defect quantification method.

Abstract: The present disclosure provides a method and a device for detecting and evaluating a defect with electromagnetic multi-field coupling. The method includes magnetizing a pipeline with the electromagnetic multi-field coupling; detecting a defect of the pipeline along an axial direction of the pipeline at a constant speed; collecting signals at a position of the defect to obtain magnetic leakage signals in three dimensions and an electrical impedance signal; pre-processing the collected signals; decoupling the pre-processed signals, to obtain decoupled magnetic leakage signals and a decoupled electrical impedance signal; performing impedance analysis on the decoupled electrical impedance signal, and determining a type of the defect based on a phase angle of the decoupled electrical impedance signal; and performing quantification analysis on the decoupled magnetic leakage signals and performing quantification evaluation on a size of the defect using a neural network defect quantification method.

Abstract: A high-precision imaging and detecting device for detecting a small defect of a pipeline by a helical magnetic matrix. The device includes: a helical excitation module including a helical excitation coil; a magnetic matrix detection module, disposed at an inner side of the helical excitation coil and including at least one magnetic sensor group arranged at intervals along an axial direction of the helical excitation coil, group including a plurality of magnetic sensors evenly spaced apart and arranged along a circumferential direction of the helical excitation coil, and the magnetic sensor being configured to detect an induction magnetic field of the pipeline; a signal processing module, connected with the magnetic matrix detection module, and configured to receive, process and output an induction magnetic field signal of the pipeline detected by the magnetic sensor.

Abstract: A high-precision imaging and detecting device for detecting a small defect of a pipeline by a helical magnetic matrix. The device includes: a helical excitation module including a helical excitation coil; a magnetic matrix detection module, disposed at an inner side of the helical excitation coil and including at least one magnetic sensor group arranged at intervals along an axial direction of the helical excitation coil, group including a plurality of magnetic sensors evenly spaced apart and arranged along a circumferential direction of the helical excitation coil, and the magnetic sensor being configured to detect an induction magnetic field of the pipeline; a signal processing module, connected with the magnetic matrix detection module, and configured to receive, process and output an induction magnetic field signal of the pipeline detected by the magnetic sensor.

Abstract: An embodiment of the present disclosure provides an electronic panel. The electronic panel comprises a protection cover having a visible area and a non-visible area, and a plurality of mask layers sequentially disposed on the non-visible area of the protection cover, wherein at least one of the mask layers has at least an escape ditch. Bubbles produced during the coating process can be discharged from the escape ditch, thereby improving the product's appearance and light transmittance. In addition, the present disclosure further provides a method of manufacturing the electronic panel and an electronic device.

Abstract: An embodiment of the present disclosure provides an electronic panel. The electronic panel comprises a protection cover having a visible area and a non-visible area, and a plurality of mask layers sequentially disposed on the non-visible area of the protection cover, wherein at least one of the mask layers has at least an escape ditch. Bubbles produced during the coating process can be discharged from the escape ditch, thereby improving the product's appearance and light transmittance. In addition, the present disclosure further provides a method of manufacturing the electronic panel and an electronic device.