Abstract: A laser-sinterable resin powder, which retains properties of styrene resins such as impact resistance and low water absorption and shows sharp decrease of melt viscosity similarly to crystalline resins at a temperature not lower than the glass transition temperature can be made of a thermoplastic resin composition containing 10-80 mass % of a crystalline resin (A) with a melting point of 80-250° C. and 20-90 mass % of a styrene resin (B), and having a 50% average particle diameter of 10-100 ?m. The Component (A) is preferably a polyolefin resin. The Component (B) is preferably a rubber-reinforced styrene resin composition, wherein the rubber component is preferably an ethylene-?-olefin copolymer rubber and/or a hydrogenated product of a diene rubber. The laser-sinterable powder preferably has a melt flow rate of 5-500 g/10 min.

Abstract: The objective of the present invention is to provide a heat-dissipating resin composition that is used for forming a substrate for LED mounting or a reflector provided on the substrate for LED mounting and is excellent in heat dissipation, electrical insulation, heat resistance and light resistance while an LED element emits light, a substrate for LED mounting and a reflector comprising the composition. The present composition comprises a thermoplastic resin such as modified PBT and a thermally conductive filler consisting of scaly boron nitride or the like, and has thermal deformation temperature of 120° C. or higher, a thermal conductivity of 2.0 W/(m·K) or higher, and a thermal emissivity of 0.7 or higher.