Patents by Inventor Fusamori Araki

Fusamori Araki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060009581
    Abstract: Provided is a self-bonding insulated wire in which a bonding layer is formed on an insulated wire, wherein the bonding layer is formed by applying a bonding varnish obtained by dissolving a crystalline copolyamide resin having a melting point within a temperature range of 105 to 150° C. and an alcohol-soluble copolyamide resin having a flexural modulus of 1500 MPa or more in a mixed organic solvent containing an alcoholic organic solvent. Because the self-bonding insulated wire of the present invention has a reduced amount of remaining phenolic solvent in its bonding layer, the wire is characterized in that the odor of the phenolic solvent released from the wire and the odor of the phenolic solvent which generates during the fabrication of a deflection yoke coil from the self-bonding insulated wire by means of a coil winder are reduced and that the initial twist of the deflection yoke coil after coiling, heat bonding and press molding is small.
    Type: Application
    Filed: September 17, 2003
    Publication date: January 12, 2006
    Inventors: Fusamori Araki, Kazushige Tamura, Seiichi Nagamine
  • Patent number: 6444916
    Abstract: A self-bonding insulated wire having a bonding layer on an insulated wire, the bonding layer including a crystalline copolyamide having a melting point within the range of 105 to 150° C. and a relative viscosity of 1.4 to 1.6 measured at 25° C. with respect to a 0.5% by weight m-cresol solution thereof, and optionally at least one member selected from the group of a high-melting nylon having a melting point within the range of 200 to 300° C. and an antioxidant. The bonding layer can be formed from a coating having an increased resin concentration and the residual solvent content of the bonding layer is small. The self-bonding insulated wire and self-bonding litz wire composed thereof provide deflecting coils having a decreased strain, good adhesive property and good heat resistance.
    Type: Grant
    Filed: March 28, 2001
    Date of Patent: September 3, 2002
    Assignee: Kaneka Corporation
    Inventors: Kazushige Tamura, Fusamori Araki, Seiichi Nagamine
  • Publication number: 20010038915
    Abstract: A self-bonding insulated wire having a bonding layer on an insulated wire, the bonding layer comprising a crystalline copolyamide having a melting point within the range of 105 to 150° C. and a relative viscosity of 1.4 to 1.6 measured at 25° C. with respect to a 0.5% by weight m-cresol solution thereof, and optionally at least one member selected from the group consisting of a high-melting nylon having a melting point within the range of 200 to 300° C. and an antioxidant. The bonding layer can be formed from a coating having an increased resin concentration and the residual solvent content of the bonding layer is small. The self-bonding insulated wire and self-bonding litz wire comprised thereof provide deflecting coils having a decreased strain, good adhesive property and good heat resistance.
    Type: Application
    Filed: March 28, 2001
    Publication date: November 8, 2001
    Applicant: KANEKA CORPORATION
    Inventors: Kazushige Tamura, Fusamori Araki, Seiichi Nagamine