Patents by Inventor Fusao Sato

Fusao Sato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11705281
    Abstract: A multilayer ceramic capacitor includes: a multilayer chip in which dielectric layers mainly composed of ceramic and internal electrode layers are alternately stacked so that the internal electrode layers are alternately exposed to two end faces of the multilayer chip having a substantially rectangular parallelepiped shape; and a pair of external electrodes formed from the two end faces to at least one side face of side faces, wherein each external electrode includes a metal layer formed from the end face to the at least one side face and mainly composed of copper, and an oxide layer covering at least a part of the metal layer, mainly composed of copper oxide, and having a maximum thickness of 0.5 ?m or greater, wherein a first surface, which is in contact with the plated layer, of the oxide layer has Cu particles formed thereon.
    Type: Grant
    Filed: June 25, 2021
    Date of Patent: July 18, 2023
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Tomoaki Nakamura, Mikio Tahara, Masako Kanou, Fusao Sato
  • Publication number: 20210319954
    Abstract: A multilayer ceramic capacitor includes: a multilayer chip in which dielectric layers mainly composed of ceramic and internal electrode layers are alternately stacked so that the internal electrode layers are alternately exposed to two end faces of the multilayer chip having a substantially rectangular parallelepiped shape; and a pair of external electrodes formed from the two end faces to at least one side face of side faces, wherein each external electrode includes a metal layer formed from the end face to the at least one side face and mainly composed of copper, and an oxide layer covering at least a part of the metal layer, mainly composed of copper oxide, and having a maximum thickness of 0.5 ?m or greater, wherein a first surface, which is in contact with the plated layer, of the oxide layer has Cu particles formed thereon.
    Type: Application
    Filed: June 25, 2021
    Publication date: October 14, 2021
    Inventors: Tomoaki NAKAMURA, Mikio TAHARA, Masako KANOU, Fusao SATO
  • Patent number: 11081282
    Abstract: A multilayer ceramic capacitor includes: a multilayer chip in which dielectric layers mainly composed of ceramic and internal electrode layers are alternately stacked so that the internal electrode layers are alternately exposed to two end faces, which face each other, of the multilayer chip, the multilayer chip having a substantially rectangular parallelepiped shape; and a pair of external electrodes formed from the two end faces of the multilayer chip to at least one side face of side faces of the multilayer chip, wherein each of the pair of external electrodes includes a metal layer and an oxide layer, the metal layer being formed from the end face to the at least one side face and being mainly composed of copper, the oxide layer covering at least a part of the metal layer, being mainly composed of copper oxide, and having a maximum thickness of 0.5 ?m or greater.
    Type: Grant
    Filed: May 13, 2019
    Date of Patent: August 3, 2021
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Tomoaki Nakamura, Mikio Tahara, Masako Kanou, Fusao Sato
  • Publication number: 20190355520
    Abstract: A multilayer ceramic capacitor includes: a multilayer chip in which dielectric layers mainly composed of ceramic and internal electrode layers are alternately stacked so that the internal electrode layers are alternately exposed to two end faces, which face each other, of the multilayer chip, the multilayer chip having a substantially rectangular parallelepiped shape; and a pair of external electrodes formed from the two end faces of the multilayer chip to at least one side face of side faces of the multilayer chip, wherein each of the pair of external electrodes includes a metal layer and an oxide layer, the metal layer being formed from the end face to the at least one side face and being mainly composed of copper, the oxide layer covering at least a part of the metal layer, being mainly composed of copper oxide, and having a maximum thickness of 0.5 ?m or greater.
    Type: Application
    Filed: May 13, 2019
    Publication date: November 21, 2019
    Inventors: Tomoaki NAKAMURA, Mikio TAHARA, Masako KANOU, Fusao SATO
  • Patent number: D452229
    Type: Grant
    Filed: December 13, 2000
    Date of Patent: December 18, 2001
    Assignee: DX Antenna Company, Limited
    Inventor: Fusao Sato
  • Patent number: D458598
    Type: Grant
    Filed: April 24, 2001
    Date of Patent: June 11, 2002
    Assignee: DX Antenna Company, Limited
    Inventor: Fusao Sato
  • Patent number: D467910
    Type: Grant
    Filed: December 28, 2001
    Date of Patent: December 31, 2002
    Assignee: DX Antenna Company, Limited
    Inventor: Fusao Sato
  • Patent number: D468302
    Type: Grant
    Filed: December 28, 2001
    Date of Patent: January 7, 2003
    Assignee: DX Antenna Company, Limited
    Inventor: Fusao Sato