Patents by Inventor Fusao Tsubokura

Fusao Tsubokura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device for use in a large scale integration circuit
    Patent number: 4631571
    Abstract: An output signal is derived from an output buffer to an external lead in a semiconductor device. In general, the output buffer is constructed using an MOS transistor and is located near a bonding pad on the chip. Therefore, the number of bonding pads which can be formed on the chip is limited by the output buffer space. The present invention provides the output buffer with a tapered or tiered shape which reduces the pitch between bonding pads. Thus, a large number of bonding pads (output buffers) can be integrated in a semiconductor chip according to the present invention.
    Type: Grant
    Filed: March 14, 1984
    Date of Patent: December 23, 1986
    Assignee: NEC Corporation
    Inventor: Fusao Tsubokura