Abstract: An electro-optical device includes: a substrate; a plurality of wiring lines which is formed on the substrate; and an IC which is mounted on the substrate so as to be electrically connected to the plurality of wiring lines. At least a pair of wiring lines among the plurality of wiring lines include a first conductive layer formed on the substrate and a second conductive layer formed on at least the first conductive layer. The first conductive layer and the second conductive layer have different resistance values. The first conductive layer of one of the pair of wiring lines has a plurality of first resistors each extending toward the other wiring line, and the second conductive layer of the other wiring line has a second resistor extending toward the one wiring line. The plurality of first resistors is connected to the second resistor.

Abstract: A voltage supply circuit includes a first holding element with a first end and a second end that supplies a voltage held between the first end and the second end to a load, the second end being connected to a ground, and a second holding element with a first end and a second end, the first end of the second holding element being electrically connected to the first end of the first holding element. The voltage supply circuit also includes a charging circuit that charges the second holding element with a voltage higher than the voltage to be supplied to the load in a first mode, and a potential adjusting circuit that shifts a potential at the second end of the second holding element towards a potential at the first end of the first holding element according to the voltage held by the first holding element or the second holding element in a second mode exclusive with respect to the first mode.

Abstract: An electrooptical device includes a substrate that holds an electrooptical substance, a first substrate line and a second substrate line provided on the substrate, a semiconductor device provided on the substrate, a first input bump and a second input bump provided on a surface of the semiconductor device, the surface being close to the substrate, an output bump provided on the surface of the semiconductor device to be connected to the first substrate line, a base material mounted on the substrate, a first line provided on the base material to be electrically connected to the first input bump, and a second line provided on the base material to be electrically connected to the second input bump via the second substrate line.

Abstract: A power-supply circuit includes a capacitor, which is connected to a terminal at a first end while being grounded at the second end, for supplying a hold voltage between both ends thereof to a load; a capacitor connected, via a diode, to the terminal at a first end; an operational amplifier for raising a voltage at the second end of the capacitor, in response to a reduction in the hold voltage, such that the hold voltage becomes equal to a target voltage; and a transistor.