Abstract: An ion implantation method and device for forming an ion implantation area in a predetermined area of a substrate is provided. The method comprises the following steps. First, an ion beam is provided, then a first shape of cross-section and a first ion density distribution of the ion beam are detected. Then, a second shape of cross-section and a second ion density distribution of the ion beam are detected by moving the ion beam along a predetermined scanning path. Thereafter, the predetermined scanning path is adjusted and optimized according to the first shape of cross-section, the first ion density distribution, the second shape of cross-section and the second ion density distribution. Then, the ion beam is optimized along the optimized predetermined scanning path to form the ion implantation area in the predetermined area of the substrate.

Abstract: An ion implantation method and device for forming an ion implantation area in a predetermined area of a substrate is provided. The method comprises the following steps. First, an ion beam is provided, then a first shape of cross-section and a first ion density distribution of the ion beam are detected. Then, a second shape of cross-section and a second ion density distribution of the ion beam are detected by moving the ion beam along a predetermined scanning path. Thereafter, the predetermined scanning path is adjusted and optimized according to the first shape of cross-section, the first ion density distribution, the second shape of cross-section and the second ion density distribution. Then, the ion beam is optimized along the optimized predetermined scanning path to form the ion implantation area in the predetermined area of the substrate.

Abstract: A method and an apparatus for drying semiconductor wafers by using an IPA drying apparatus. The present invention uses a vapor generator to generate an IPA vapor. The IPA vapor is generated and saved in a closed surrounding and then transferred in a porous hollow plate in the dryer tank by using a quartz pipe. The IPA vapor is diffused evenly from the porous hollow plate. Furthermore, the present invention increases the safety of the process and can easily control the input amount of the IPA vapor.

Abstract: The present invention provides a method and an apparatus for drying semiconductor wafers by using an IPA drying apparatus. The present invention uses a vapor generator to generate an IPA vapor. The IPA vapor is generated and saved in a closed surrounding and then transferred in a porous hollow plate in the dryer tank by using a quartz pipe. The IPA vapor is diffused evenly from the porous hollow plate. Furthermore, the present invention increases the safety of the process and can easily control the input amount of the IPA vapor.