Abstract: A hydrogen production apparatus including a photocatalyst and generating hydrogen from water includes a wavelength separation unit separating sunlight by wavelength, an infrared light conversion unit converting infrared light separated by the wavelength separation unit to visible light, and an ultraviolet light conversion unit converting ultraviolet light separated by the wavelength separation unit to visible light.

Abstract: A customer's request is more appropriately reflected in the design. A method of processing a request for designing a device receives a required specification for a device from a user input and output device, searches a case similar to the required specification in the old case specification information, outputs the case similar to the required specification found in the old case specification information to the user input and output device, and calculates a specification of a design result of the device according to the required specification for an unauthorized input for the similar case from the user input and output device, or transmits a request for designing the device according to the required specification to an external design system, and outputs the design result of the device calculated or received from the design system to the user input and output device.

Abstract: To provide a semiconductor device having a high efficiency of arranging a TSV, there is provided a semiconductor device which is stacked with a semiconductor chip, and in which the semiconductor chips contiguous each other are electrically connected by plural TSVs, the semiconductor chip includes a core circuit and plural IO circuits arranged at a surrounding thereof, the TSV is arranged in the core circuit, and a pitch of arranging the TSVs is an integer-fold of a cell pitch of a library configuring the core circuit.

Abstract: In a stacked chip system, an IO circuit connected to a TSV pad for IO and a switch circuit constitute an IO channel in each chip, the IO channels as many as the maximum scheduled number of stacks are coupled together and connected to constitute an IO group, and the chip has one or more such IO groups. Each TSV pad for IO is connected with a through via to an IO terminal at the same position in a chip of another layer. On an interposer, if the actual number of stacks is less than the maximum scheduled number of stacks, connection pads for IO in adjacent IO groups on the interposer are connected via a conductor.

Abstract: To provide a semiconductor device having a high efficiency of arranging a TSV, there is provided a semiconductor device which is stacked with a semiconductor chip, and in which the semiconductor chips contiguous each other are electrically connected by plural TSVs, the semiconductor chip includes a core circuit and plural IO circuits arranged at a surrounding thereof, the TSV is arranged in the core circuit, and a pitch of arranging the TSVs is an integer-told of a ceil pitch of a library configuring the core circuit.

Abstract: To realize a random number generating circuit that is optimum for a liquid crystal display device that is used in a terminal device that includes a display/input component. A liquid crystal display device includes a liquid crystal display panel, a control circuit and a random number generating circuit, the random number generating circuit comprises plural shift registers, an output circuit and a register that stores an initial value, and the random number generating circuit is equipped with plural initial values, whereby the randomness of the random numbers is improved. Further, it becomes possible to increase and output frequencies by the output circuit because it is possible to output respectively different random numbers from the plural shift registers.

Abstract: A communication system by electrostatic coupling and electromagnetic induction includes: a first transmission part (3a) and a first reception part (3b) which exchange data therebetween through non-contact communication using electrostatic coupling; a second transmission part (4a) and a second reception part (4b) which exchange data therebetween through non-contact communication using electromagnetic induction; and an image display device (8) which displays an image based on the data thus received. With this configuration, it is possible to make communication performed by the first transmission part (3a) and the first reception part (3b) communication with higher speed, larger volume, and higher reliability.

Abstract: A semiconductor integrated circuit device capable of achieving improvement of I/O processing performance, reduction of power consumption, and reduction of cost is provided. Provided is a semiconductor integrated circuit device including, for example, a plurality of semiconductor chips stacked and mounted, the chips having data transceiving terminals bus-connected via through-vias, and data transmission and reception are performed via the bus with using the lowest source voltage among source voltages of internal core circuits of the chips. In accordance with that, a source voltage terminal of an n-th chip to be at the lowest source voltage is connected with source voltage terminals for data transceiving circuits of the other semiconductor chips via through-vias.

Abstract: In order to restrain increase in frame area caused along with a larger number of channels to a minimum, there is provided an image display device that adopts a communication method in which a signal is transmitted/received with the use of electrostatic capacitance coupling. A first board includes: a tabular first power supply line, a tabular second power supply line, a semiconductor element, and a tabular first electrode group. A second board includes: a tabular second electrode group and a tabular common electrode. In a state where the first board and the second board are laid on each other, the first electrode group overlaps the second electrode group while one of the first power supply line and the second power supply line overlaps the common electrode.

Abstract: In a stacked chip system, an IO circuit connected to a TSV pad for IO and a switch circuit constitute an IO channel in each chip, the IO channels as many as the maximum scheduled number of stacks are coupled together and connected to constitute an IO group, and the chip has one or more such IO groups. Each TSV pad for IO is connected with a through via to an IO terminal at the same position in a chip of another layer. On an interposer, if the actual number of stacks is less than the maximum scheduled number of stacks, connection pads for IO in adjacent IO groups on the interposer are connected via a conductor.

Abstract: An image display device includes a display panel having plural pixels and a second board having a transmitting electrode, the display panel having a first substrate that is disposed so as to overlap the second board, each pixel having a pixel electrode and a counter electrode, and the counter electrode being formed in a planar shape and being commonly provided to the pixel electrodes of each pixel; the counter electrode being divided into a portion A corresponding to the transmitting electrode of the second board and a portion B other than it, and the portions A and B of the counter electrode being connected to a common voltage through resistors. The portion A of the counter electrode constitutes the receiving electrode, and the portion A of the counter electrode acting as the receiving electrode is connected to a receiving circuit in the display panel through a decoupling capacitor.

Abstract: In a through-via-hole path of semiconductor chips stacked in N stages, repeater circuits are provided in the respective semiconductor chips. For example, a signal transmitted from an output buffer circuit of the semiconductor chip is transmitted to an input buffer circuit of the semiconductor chip via the repeater circuits of the respective semiconductor chips. The respective repeater circuits can isolate impedances on input sides and output sides, and therefore, a deterioration of a waveform quality accompanied by a parasitic capacitance parasitic on the through-via-hole path of the respective semiconductor chips can be reduced and a high speed signal can be transmitted.

Abstract: In a through-via-hole path of semiconductor chips stacked in N stages, repeater circuits are provided in the respective semiconductor chips. For example, a signal transmitted from an output buffer circuit of the semiconductor chip is transmitted to an input buffer circuit of the semiconductor chip via the repeater circuits of the respective semiconductor chips. The respective repeater circuits can isolate impedances on input sides and output sides, and therefore, a deterioration of a waveform quality accompanied by a parasitic capacitance parasitic on the through-via-hole path of the respective semiconductor chips can be reduced and a high speed signal can be transmitted.

Abstract: A semiconductor integrated circuit device capable of achieving improvement of I/O processing performance, reduction of power consumption, and reduction of cost is provided. Provided is a semiconductor integrated circuit device including, for example, a plurality of semiconductor chips stacked and mounted, the chips having data transceiving terminals bus-connected via through-vias, and data transmission and reception are performed via the bus with using the lowest source voltage among source voltages of internal core circuits of the chips. In accordance with that, a source voltage terminal of an n-th chip to be at the lowest source voltage is connected with source voltage terminals for data transceiving circuits of the other semiconductor chips via through-vias.

Abstract: An image display device includes a display panel having plural pixels and a second board having a transmitting electrode, the display panel having a first substrate that is disposed so as to overlap the second board, each pixel having a pixel electrode and a counter electrode, and the counter electrode being formed in a planar shape and being commonly provided to the pixel electrodes of each pixel; the counter electrode being divided into a portion A corresponding to the transmitting electrode of the second board and a portion B other than it, and the portions A and B of the counter electrode being connected to a common voltage through resistors. The portion A of the counter electrode constitutes the receiving electrode, and the portion A of the counter electrode acting as the receiving electrode is connected to a receiving circuit in the display panel through a decoupling capacitor.

Abstract: In order to restrain increase in frame area caused along with a larger number of channels to a minimum, there is provided an image display device that adopts a communication method in which a signal is transmitted/received with the use of electrostatic capacitance coupling. A first board includes: a tabular first power supply line, a tabular second power supply line, a semiconductor element, and a tabular first electrode group. A second board includes: a tabular second electrode group and a tabular common electrode. In a state where the first board and the second board are laid on each other, the first electrode group overlaps the second electrode group while one of the first power supply line and the second power supply line overlaps the common electrode.

Abstract: A communication system by electrostatic coupling and electromagnetic induction includes: a first transmission part (3a) and a first reception part (3b) which exchange data therebetween through non-contact communication using electrostatic coupling; a second transmission part (4a) and a second reception part (4b) which exchange data therebetween through non-contact communication using electromagnetic induction; and an image display device (8) which displays an image based on the data thus received. With this configuration, it is possible to make communication performed by the first transmission part (3a) and the first reception part (3b) communication with higher speed, larger volume, and higher reliability.

Abstract: Provided is a capacitor coupling type power transmission circuit in which a variation in receiving side voltage due to a variation in capacitance is suppressed to prevent an influence on a variation in load current in a display panel. An insulating board of the display panel is sandwiched by capacitive coupling electrodes formed on each of a transmitting side board and a board of the display panel, thereby forming capacitors. A non-contact transmission is performed by the capacitors. An alternating current voltage signal obtained by electrodes on a display panel side is rectified by a rectifier including diodes. A constant voltage circuit which is a shunt regulator including a diode array in which a resistor and a plurality of diodes are connected in series is provided to maintain a stabilized voltage irrespective of a variation in load in the display panel.

Abstract: To realize a random number generating circuit that is optimum for a liquid crystal display device that is used in a terminal device that includes a display/input component. A liquid crystal display device includes a liquid crystal display panel, a control circuit and a random number generating circuit, the random number generating circuit comprises plural shift registers, an output circuit and a register that stores an initial value, and the random number generating circuit is equipped with plural initial values, whereby the randomness of the random numbers is improved. Further, it becomes possible to increase and output frequencies by the output circuit because it is possible to output respectively different random numbers from the plural shift registers.

Abstract: A capacitive coupling-type transmitting and receiving circuit for information signal is provided in which attenuation of a signal on a non-contact transmission path via a capacitor and a change of voltage on the receiving side due to a slight change in capacitance are suppressed, modulation and demodulation processes of signals are unnecessary, and non-contact transmission which does not depend on the transmission rate is enabled. The capacitor is formed with a transmitting electrode on a transmission board and a receiving electrode on a display panel board, and an insulating member is interposed between the electrodes. The transmitting board comprises a transmission signal processing circuit which converts display data from an external signal source into a voltage signal. The display panel board comprises an impedance converter circuit and a reception signal processing circuit.