Patents by Inventor Futoshi Matsui

Futoshi Matsui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7500837
    Abstract: A small size gear pump having a disc-shaped case, inside which a flat cylindrical motor rotor chamber, a bearing chamber and a flat cylindrical gear chamber are arranged eccentrically from the bearing chamber and the rotor chamber, which are piled sequentially along an axial direction and are communicating to each other.
    Type: Grant
    Filed: July 7, 2004
    Date of Patent: March 10, 2009
    Assignees: Fukui Prefecture, Japan Aerospace Exploration Agency
    Inventors: Naoki Miyagi, Fujio Yamamoto, Yuichi Murai, Koji Miyazaki, Futoshi Matsui, Yuji Aoyagi
  • Publication number: 20050042124
    Abstract: A circular disc shape case 11 includes a motor rotor chamber 12, a bearing chamber 13 and a gear chamber 14 piled sequentially and being communicated with each other. A suction port 15 is connected to the motor rotor chamber 12, and a discharge port 16 is connected to the gear chamber 14, which communicate with outside respectively. A rotating shaft 18 having an end positioned in the motor rotor chamber 13 and the other end extending to the gear chamber 14. A rotor 22 is fixed around the rotation shaft 18 in the motor rotor chamber 13. A first bearing 19 is provided for supporting the end of the rotating shaft 18 in radial and thrust directions. A second bearing 20 is provided in the bearing chamber 13 for supporting an intermediate portion of the rotating shaft 18 in radial direction.
    Type: Application
    Filed: July 7, 2004
    Publication date: February 24, 2005
    Applicants: Naoki Miyagi, Fukui Prefecture, Fujikura Ltd.
    Inventors: Naoki Miyagi, Fujio Yamamoto, Yuichi Murai, Koji Miyazaki, Futoshi Matsui, Yuji Aoyagi
  • Patent number: 5733598
    Abstract: A flexible wiring board includes a printed conductive circuit layer formed on an insulating film, a metallic layer formed on the printed conductive circuit layer, and an insulating layer formed on the metallic layer. A method of making a flexible wiring board includes the steps of forming a conductive circuit layer by screen printing a wiring pattern using a conductive paste, baking the printed wiring pattern, and forming a metallic layer on the printed conductive circuit layer by a plating method.
    Type: Grant
    Filed: March 10, 1997
    Date of Patent: March 31, 1998
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Naoki Sera, Toshiharu Fukui, Kouji Tanabe, Futoshi Matsui
  • Patent number: 5461202
    Abstract: A flexible wiring board includes a printed conductive circuit layer formed on an insulating film, a metallic layer formed on thed printed conductive circuit layer, and an insulating layer formed on the metallic layer. A method of making a flexible wiring board includes the steps of forming a conductive circuit layer by screen printing a wiring pattern using a conductive paste, baking the printed wiring pattern, and forming a metallic layer on the printed conductive circuit layer by a plating method.
    Type: Grant
    Filed: October 5, 1993
    Date of Patent: October 24, 1995
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Naoki Sera, Toshiharu Fukui, Kouji Tanabe, Futoshi Matsui
  • Patent number: 5354392
    Abstract: A method for electrically connecting an upper wiring with a lower wiring consists of the steps of arranging the upper wiring mixed with thermo-softening material on an upper insulating sheet, arranging the lower wiring mixed with thermo-softening material on a lower insulating sheet, putting the upper insulating sheet on the lower insulating sheet to bring the upper wiring into contact with the lower wiring, and providing ultrasonic vibration to the upper and lower wirings and the upper insulating sheet while pushing the upper insulating sheet toward the lower insulating sheet. In these steps, the upper and lower wirings and the upper insulating sheet are heated and melted because friction heat is generated by the ultrasonic vibration. Thereafter, the upper insulating sheet is pushed into the upper and lower wirings while pushing these wirings aside and is boded with the lower insulating sheet. Also, the upper wiring is bonded with the lower wiring so that these wirings are electrically connected.
    Type: Grant
    Filed: January 13, 1993
    Date of Patent: October 11, 1994
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kouichi Santo, Naohiro Nishioka, Kenji Otomo, Kouji Tanabe, Futoshi Matsui
  • Patent number: 5313027
    Abstract: A push switch is capable of performing a first switching operation and subsequently a second switching operation when a pressing force is applied to the switch. The push switch includes (a) an insulating membrane having at least one dome with at least a portion thereof overlaid by or serving as an inner conductor and at least a portion of its outer periphery overlaid by or serving as an outer conductor, (b) an insulating substrate having thereupon an inner pole contact disposed at a position opposing to the inner conductor and an outer pole contact disposed at a position opposing to the outer conductor, respectively, and (c) a spacer placed between the insulating membrane and the insulating substrate for spacing the conductor apart from the pole contacts during the time when no pressing force is applied to the switch.
    Type: Grant
    Filed: March 12, 1993
    Date of Patent: May 17, 1994
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kenji Inoue, Futoshi Matsui, Kouichi Santo
  • Patent number: 4794215
    Abstract: A push switch having a mount base 11 made of a heat resisting and insulating material and having a recess 11a in the top surface thereof, the recess 11a receiving a plurality of contact terminals 12a, 13a disposed such that contact portions constituting at least a pair of conductor circuits are arranged in the recess, a curved push spring 14 having an inverting function and disposed in the recess 11a, and an operating portion through which the push spring 14 is operated so as to turn the switch on and off. A flexible heat resistant film 15 constituting the operating portion is attached to the mount base in a manner such as to cover the entire area of opening of the recess. With this dust proof and semi-hermetic arrangement, it is possible to prevent invasion by dusts and other foreign matters which are strictly to be kept away from the switch. The invasion by flux and molten solder also is avoided so that the switch can be manufactured by new methods such as solder dipping.
    Type: Grant
    Filed: August 8, 1986
    Date of Patent: December 27, 1988
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masaki Sawada, Futoshi Matsui, Katsuyoshi Onda
  • Patent number: 4652947
    Abstract: A rotary encoder comprises a case containing a rotary brush setting plate and an idler gear which is associated with an inside gear formed on the brush setting plate and a reduction gear contained in the case and connected to a driving shaft penetrating the case. Brushes on the rotary brush setting plate rotatingly slide on the plural pulse producing conductive patterns formed on inside surface of the case, thereby to effect switching in plural modes as the shaft revolves.
    Type: Grant
    Filed: May 17, 1983
    Date of Patent: March 24, 1987
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Shunzo Oka, Futoshi Matsui