Abstract: A coating head includes: a plurality of nozzles; a plurality of pressure chambers communicating with the plurality of nozzles; an ink flow path communicating with the plurality of pressure chambers; and a coating layer that is at least partially provided on liquid contact surfaces of the plurality of nozzles, the plurality of pressure chambers, and the ink flow path.

Abstract: An ink jet head includes a piezoelectric element that is driven in a d33 mode, a pressure generation chamber in which a pressure is generated by the piezoelectric element, and an individual ink supply flow passage that through which the ink is supplied to the pressure generation chamber. The ink jet head includes an individual ink discharge flow passage that through which the ink is discharged from the pressure generation chamber, and a nozzle that ejects the ink from the pressure generation chamber. In a cross-sectional view in a direction orthogonal to an arrangement direction of the nozzle, inner diameters of the pressure generation chamber, the individual ink supply flow passage, and the individual ink discharge flow passage are shorter on a part close to the nozzle than a part close to the piezoelectric element side. Accordingly, an ink jet head capable of ejecting high-viscosity ink can be provided.

Abstract: An ink jet head includes a piezoelectric element that is driven in a d33 mode, a pressure generation chamber in which a pressure is generated by the piezoelectric element, and an individual ink supply flow passage that through which the ink is supplied to the pressure generation chamber. The ink jet head includes an individual ink discharge flow passage that through which the ink is discharged from the pressure generation chamber, and a nozzle that ejects the ink from the pressure generation chamber. In a cross-sectional view in a direction orthogonal to an arrangement direction of the nozzle, inner diameters of the pressure generation chamber, the individual ink supply flow passage, and the individual ink discharge flow passage are shorter on a part close to the nozzle than a part close to the piezoelectric element side. Accordingly, an ink jet head capable of ejecting high-viscosity ink can be provided.

Abstract: A liquid discharge device includes a nozzle from which liquid drops are discharged, a fixing part for fixing the nozzle, and a driving part generating displacement, in which the nozzle is fixed to a first holding part in the driving part and a second holding part in the fixing part.

Abstract: An object of the disclosure is to provide an inkjet head that makes it possible to realize alleviation of ink-discharge malfunction due to fluid crosstalk possibly caused among multiple discharge components, and that also simultaneously makes it possible to maintain a desirable volume of discharged liquid droplets. Furthermore, another object of the disclosure is to provide an inkjet device including the inkjet head.

Abstract: A high precision printing method taking into consideration the variance in the thickness of a printing target. An ink-jet printing method, including: (i) measuring a distance between a printing target and at least one nozzle; (ii) measuring a flying speed and a flying angle of an ink(a) discharged from the at least one nozzle; (iii) printing a test substrate with an ink to identify a location on which an ink(b) is spotted, and calculating a thickness-related displacement that is a displacement from the location on which the ink is spotted, based on a thickness difference between the printing target and the test substrate from results obtained in Step (i), and the flying speed and the flying angle of the ink(a) obtained in Step (ii); and (iv) discharging an ink(c) from the at least one nozzle to achieve actual printing of the printing target with the ink(c) while correcting the thickness-related displacement.

Abstract: An object of the disclosure is to provide an inkjet head that makes it possible to realize alleviation of ink-discharge malfunction due to fluid crosstalk possibly caused among multiple discharge components, and that also simultaneously makes it possible to maintain a desirable volume of discharged liquid droplets. Furthermore, another object of the disclosure is to provide an inkjet device including the inkjet head.

Abstract: A high precision printing method taking into consideration the variance in the thickness of a printing target. An ink-jet printing method, including: (i) measuring a distance between a printing target and at least one nozzle; (ii) measuring a flying speed and a flying angle of an ink(a) discharged from the at least one nozzle; (iii) printing a test substrate with an ink to identify a location on which an ink(b) is spotted, and calculating a thickness-related displacement that is a displacement from the location on which the ink is spotted, based on a thickness difference between the printing target and the test substrate from results obtained in Step (i), and the flying speed and the flying angle of the ink(a) obtained in Step (ii); and (iv) discharging an ink(c) from the at least one nozzle to achieve actual printing of the printing target with the ink(c) while correcting the thickness-related displacement.

Abstract: A connection method includes softening a resin film of a thermosetting resin by heating an element electrode of a piezoelectric body and a substrate electrode of a flexible cable to be connected to the piezoelectric body with the element electrode and the substrate electrode being pressed into contact with each other via the resin film; partially pushing out the molten resin film from an opposing position of the element electrode and the substrate electrode so as to bring a solder layer provided on the substrate electrode into contact with the element electrode; curing the resin film and melting solder in the solder layer by further raising a heating temperature; discharging excess solder in a direction defined by the cured resin film; and then solidifying the solder in the solder layer so as to solder the element electrode and the substrate electrode together.

Abstract: A connection method disclosed herein includes softening a resin film of a thermosetting resin by heating an element electrode of a piezoelectric body and a substrate electrode of a flexible cable to be connected to the piezoelectric body with the element electrode and the substrate electrode being pressed into contact with each other via the resin film; partially pushing out the molten resin film from an opposing position of the element electrode and the substrate electrode so as to bring a solder layer provided on the substrate electrode into contact with the element electrode; curing the resin film and melting solder in the solder layer by further raising a heating temperature; discharging excess solder in a direction defined by the cured resin film; and then solidifying the solder in the solder layer so as to solder the element electrode and the substrate electrode together.

Abstract: A connection method disclosed herein includes softening a resin film of a thermosetting resin by heating an element electrode of a piezoelectric body and a substrate electrode of a flexible cable to be connected to the piezoelectric body with the element electrode and the substrate electrode being pressed into contact with each other via the resin film; partially pushing out the molten resin film from an opposing position of the element electrode and the substrate electrode so as to bring a solder layer provided on the substrate electrode into contact with the element electrode; curing the resin film and melting solder in the solder layer by further raising a heating temperature; discharging excess solder in a direction defined by the cured resin film; and then solidifying the solder in the solder layer so as to solder the element electrode and the substrate electrode together.

Abstract: A connection method disclosed herein includes softening a resin film of a thermosetting resin by heating an element electrode of a piezoelectric body and a substrate electrode of a flexible cable to be connected to the piezoelectric body with the element electrode and the substrate electrode being pressed into contact with each other via the resin film; partially pushing out the molten resin film from an opposing position of the element electrode and the substrate electrode so as to bring a solder layer provided on the substrate electrode into contact with the element electrode; curing the resin film and melting solder in the solder layer by further raising a heating temperature; discharging excess solder in a direction defined by the cured resin film; and then solidifying the solder in the solder layer so as to solder the element electrode and the substrate electrode together.

Abstract: A vibration damping member penetrates through two mounting apertures provided in a shadow mask with tension applied thereto, so as to be attached to the shadow mask in a freely movable state. The vibration damping member has two penetrating portions each passing loosely through one of the two mounting apertures and a bridge portion linking these portions. A protrusion protruding toward the shadow mask is provided in the bridge portion of the vibration damping member. This configuration regulates a tilted angle of the vibration damping member with respect to the face of the shadow mask, thus preventing a phenomenon in which a bending portion is caught by the edge of the mounting aperture so that the vibration damping member is pinned by the shadow mask. As a result, the freely movable state of the vibration damping member can be kept always, and therefore vibrations of the shadow mask can be dampened effectively and a color cathode ray tube with reduced color displacement can be provided.

Abstract: A vibration damping member penetrates through two mounting apertures provided in a shadow mask with tension applied thereto, so as to be attached to the shadow mask in a freely movable state. The vibration damping member has two penetrating portions each passing loosely through one of the two mounting apertures and a bridge portion linking these portions. A protrusion protruding toward the shadow mask is provided in the bridge portion of the vibration damping member. This configuration regulates a tilted angle of the vibration damping member with respect to the face of the shadow mask, thus preventing a phenomenon in which a bending portion is caught by the edge of the mounting aperture so that the vibration damping member is pinned by the shadow mask. As a result, the freely movable state of the vibration damping member can be kept always, and therefore vibrations of the shadow mask can be dampened effectively and a color cathode ray tube with reduced color displacement can be provided.

Abstract: There is provided a planarization process wherein a workpiece is polished uniformly.