Abstract: A back-face protection sheet for a solar cell module exhibits excellent adhesion strength and tensile strength even under a high-temperature and high-humidity environment, by using a plastic film that has excellent characteristics such as electrical insulation characteristic, heat resistance, dimension stability, mechanical strength, weatherability, and water resistance, and using a two-part type lamination adhesive having excellent weatherability. The back-face protection sheet is made to have excellent adhesion strength and tensile strength for a long period of time, even under a high-temperature and high-humidity environment, by improving weatherability (hydrolysis resistance) as base material films, and giving weatherability (hydrolysis resistance) to the two-part type lamination adhesive to be used in pasting together the base material films.

Abstract: A back-face protection sheet for a solar cell module exhibits excellent adhesion strength and tensile strength even under a high-temperature and high-humidity environment, by using a plastic film that has excellent characteristics such as electrical insulation characteristic, heat resistance, dimension stability, mechanical strength, weatherability, and water resistance, and using a two-part type lamination adhesive having excellent weatherability. The back-face protection sheet is made to have excellent adhesion strength and tensile strength for a long period of time, even under a high-temperature and high-humidity environment, by improving weatherability (hydrolysis resistance) as base material films, and giving weatherability (hydrolysis resistance) to the two-part type lamination adhesive to be used in pasting together the base material films.

Abstract: A back-face protection sheet for a solar cell module exhibits excellent adhesion strength and tensile strength even under a high-temperature and high-humidity environment, by using a plastic film that has excellent characteristics such as electrical insulation characteristic, heat resistance, dimension stability, mechanical strength, weatherability, and water resistance, and using a two-part type lamination adhesive having excellent weatherability. The back-face protection sheet is made to have excellent adhesion strength and tensile strength for a long period of time, even under a high-temperature and high-humidity environment, by improving weatherability (hydrolysis resistance) as base material films, and giving weatherability (hydrolysis resistance) to the two-part type lamination adhesive to be used in pasting together the base material films.

Abstract: A back-protective sheet for a solar cell module includes a polyolefin resin multi-layer film having a layer A/layer B/layer C three layer constitution, a plastic film, and a UV absorbing layer disposed in this order, wherein the layer A includes a resin composition prepared by mixing a polyethylene resin and a polypropylene resin, the layer B includes a polypropylene resin composition containing white particles, and the layer C comprises a polypropylene resin composition.

Abstract: A back-face protection sheet for a solar cell module exhibits excellent adhesion strength and tensile strength even under a high-temperature and high-humidity environment, by using a plastic film that has excellent characteristics such as electrical insulation characteristic, heat resistance, dimension stability, mechanical strength, weatherability, and water resistance, and using a two-part type lamination adhesive having excellent weatherability. The back-face protection sheet is made to have excellent adhesion strength and tensile strength for a long period of time, even under a high-temperature and high-humidity environment, by improving weatherability (hydrolysis resistance) as base material films, and giving weatherability (hydrolysis resistance) to the two-part type lamination adhesive to be used in pasting together the base material films.

Abstract: A circuit board-use member has a reinforcing plate, a removable organic layer, a flexible film having a circuit pattern, and a peeling-assist layer laminated in that order; a method forms a circuit board by forming a circuit pattern on a flexible film which is adhered to a reinforcing plate with a removable organic layer interposed therebetween, and peeling the film from the plate at an angle ranging from more than 0° to 80°; and an apparatus for forming a circuit board has one of a separation means for separating the flexible film from the reinforcing plate while the film contacts a curved support body; a curved separation means for separating the reinforcing plate from a support body for the flexible film while the plate is curved; or a moving means for relatively moving holding means and peeling means having a wedge-shaped member for peeling the flexible film.

Abstract: The present invention relates to a circuit board including a flexible film provided with an extremely fine circuit pattern, a laminated member for a circuit board, and a method for making a laminated member for a circuit board with excellent productivity. A circuit board of the present invention includes a flexible film and a circuit pattern composed of a metal provided on the flexible film, and dimensional change rate of the circuit pattern is within ±0.01%. A laminated member for a circuit board of the present invention includes a reinforcing plate, a self-stick, removable organic layer, a flexible film, and a circuit pattern composed of a metal laminated in that order.

Abstract: When a number of flexible circuit boards where a circuit pattern is formed on at least one surface are connected to each other so as to form a tape-style flexible circuit board, a space for conveyance is provided in the pairs of end portions facing each other of the flexible circuit boards, at least a portion of the space for conveyance protrudes in the direction parallel to the direction of conveyance of the flexible circuit boards, and the protruding space for conveyance overlaps and is fixed to a space for conveyance of an adjacent flexible circuit board.

Abstract: The present invention relates to a circuit board including a flexible film provided with an extremely fine circuit pattern, a laminated member for a circuit board, and a method for making a laminated member for a circuit board with excellent productivity. A circuit board of the present invention includes a flexible film and a circuit pattern composed of a metal provided on the flexible film, and dimensional change rate of the circuit pattern is within ±0.01%. A laminated member for a circuit board of the present invention includes a reinforcing plate, a self-stick, removable organic layer, a flexible film, and a circuit pattern composed of a metal laminated in that order.

Abstract: The present invention relates to a circuit board including a flexible film provided with an extremely fine circuit pattern, a laminated member for a circuit board, and a method for making a laminated member for a circuit board with excellent productivity. A circuit board of the present invention includes a flexible film and a circuit pattern composed of a metal provided on the flexible film, and dimensional change rate of the circuit pattern is within ±0.01%. A laminated member for a circuit board of the present invention includes a reinforcing plate, a self-stick, removable organic layer, a flexible film, and a circuit pattern composed of a metal laminated in that order.

Abstract: A circuit board-use member has a reinforcing plate, a removable organic layer, a flexible film having a circuit pattern, and a peeling-assist layer laminated in that order; a method forms a circuit board by forming a circuit pattern on a flexible film which is adhered to a reinforcing plate with a removable organic layer interposed therebetween, and peeling the film from the plate at an angle ranging from more than 0° to 80°; and an apparatus for forming a circuit board has one of a separation means for separating the flexible film from the reinforcing plate while the film contacts a curved support body; a curved separation means for separating the reinforcing plate from a support body for the flexible film while the plate is curved; or a moving means for relatively moving holding means and peeling means having a wedge-shaped member for peeling the flexible film.

Abstract: The present invention relates to a circuit board including a flexible film provided with an extremely fine circuit pattern, a laminated member for a circuit board, and a method for making a laminated member for a circuit board with excellent productivity. A circuit board of the present invention includes a flexible film and a circuit pattern composed of a metal provided on the flexible film, and dimensional change rate of the circuit pattern is within ±0.01%. A laminated member for a circuit board of the present invention includes a reinforcing plate, a self-stick, removable organic layer, a flexible film, and a circuit pattern composed of a metal laminated in that order.

Abstract: Phase-change type rewritable optical recording media, such as optical discs, optical cards, and optical tapes, where recorded data can be erased or overwritten and where data can be recorded with high speed and high density by applying a light beam can include an optical recording medium is one that includes a laminate member, which in various embodiments contains a transparent substrate, a first dielectric layer, a recording layer, a second dielectric layer, a light absorbing layer, and/or a reflecting layer. In various embodiments of the invention, the shortest distance between recorded marks in the recording direction along the track is less than &lgr;/NA, with &lgr; and NA denoting the wavelength of the light used and the numerical aperture of the objective lens of the optical head, respectively.