Abstract: A SnBiSb series low-temperature lead-free solder and a preparation method thereof, which belongs to the technical field of low-temperature soldering. The lead-free solder includes by weight the following composition: 32.8-56.5% of Bi, 0.7-2.2% of Sb, with the remainder being Sn, wherein the weight percentages of Bi and Sb satisfy a relationship of b=0.006a2?0.672a+19.61+c, wherein the symbol a represents the weight percentage of Bi, the symbol b represents the weight percentage of Sb, and the range of c is ?1.85?c?1.85. The solder alloy has a peritectic or near peritectic structure with a low melting point, and has an excellent mechanical performance and reliability, and applicable to the field of low-temperature soldering.

Abstract: This application discloses a graphics processing method and related apparatus, and a device. The method includes: obtaining a first drawing instruction that is initiated by an application program and that corresponds to a first graphics API; calling a first graphics API in a first graphics library according to the first drawing instruction to execute the first drawing instruction, and sending a first processing notification to the application program; generating calling information of the first graphics API; and sending the calling information of the first graphics API to the client. According to the foregoing solutions, the server unidirectionally transmits calling information of a graphics API to the client, so that a requirement for a network latency can be reduced, and proper running of the application program on the server can be ensured in a disconnected network, thereby improving user experience.

Abstract: Embodiments of this application disclose a 3D graphics data compression method. The method includes: obtaining first 3D model data from a graphics application programming interface of a server; determining, based on a feature value of the 3D model data, a first role sequence to which the first 3D model data belongs; determining 3D model data that has highest similarity to the first 3D model data from the first role sequence; and obtaining a compression result of the first 3D model data based on the first 3D model data and the 3D model data that has the highest similarity.

Abstract: This application discloses a graphics processing method and related apparatus, and a device. The method includes: obtaining a first drawing instruction that is initiated by an application program and that corresponds to a first graphics API; calling a first graphics API in a first graphics library according to the first drawing instruction to execute the first drawing instruction, and sending a first processing notification to the application program; generating calling information of the first graphics API; and sending the calling information of the first graphics API to the client. According to the foregoing solutions, the server unidirectionally transmits calling information of a graphics API to the client, so that a requirement for a network latency can be reduced, and proper running of the application program on the server can be ensured in a disconnected network, thereby improving user experience.

Abstract: A SnBiSb series low-temperature lead-free solder and a preparation method thereof, which belongs to the technical field of low-temperature soldering. The lead-free solder includes by weight the following composition: 32.8-56.5% of Bi, 0.7-2.2% of Sb, with the remainder being Sn, wherein the weight percentages of Bi and Sb satisfy a relationship of b=0.006a2?0.672a+19.61=c, wherein the symbol a represents the weight percentage of Bi, the symbol b represents the weight percentage of Sb, and the range of c is ?1.85?c?1.85. The solder alloy has a peritectic or near peritectic structure with a low melting point, and has an excellent mechanical performance and reliability, and applicable to the field of low-temperature soldering.