Abstract: The invention provides a laser shock processing method for small-hole component with different thickness. In this method, different process parameters are adopted for laser shock processing of small hole members with different thicknesses, and the empirical formula was obtained by statistical analysis of the experimental results, and the empirical formula I 0 = A ? e t B ? ? s 2 Z is the relationship between power density and thickness of small hole members. According to this formula, the power density of laser shock strengthening of orifice member with different thickness is determined, and the selection and determination method of process parameters related to this is put forward. According to this method, reasonable residual compressive stress distribution can be obtained after laser shock strengthening with appropriate technology, and good strengthening effect can be achieved.

Abstract: A laser shock strengthening method for small-hole components (4) with different thicknesses. In the method, different technological parameters are used for laser shock strengthening of the small-hole components (4) with different thicknesses, statistical analysis is conducted after a large number of tests to obtain an empirical formula; the empirical formula is a relational expression AA of the power density and the thicknesses of the small-hole component (4). The power density of laser shock strengthening of the small-hole components (4) with different thicknesses can be determined according to the relational expression; and a method for selecting and determining related technological parameters is provided.