Abstract: The present invention discloses a gas pendulum style level posture sensing chip and its manufacturing method and a level posture sensor. The gas pendulum style level posture sensing chip includes: a semiconductor substrate; two sets of arm thermosensitive fuses formed on the surface of the semiconductor substrate, each set of the thermosensitive fuses including two thermosensitive fuses in parallel to each other, the two sets of thermosensitive fuses being vertical to each other; electrodes formed at the two ends of the thermosensitive fuses. For the level posture sensing chip and sensor provided by the present invention, the parallelism and verticality of the thermosensitive fuses is high in precision such that the more accurate measurement can be implemented.

Abstract: The present invention discloses a gas pendulum style level posture sensing chip and its manufacturing method and a level posture sensor. The gas pendulum style level posture sensing chip includes: a semiconductor substrate; two sets of arm thermosensitive fuses formed on the surface of the semiconductor substrate, each set of the thermosensitive fuses including two thermosensitive fuses in parallel to each other, the two sets of thermosensitive fuses being vertical to each other; electrodes formed at the two ends of the thermosensitive fuses. For the level posture sensing chip and sensor provided by the present invention, the parallelism and verticality of the thermosensitive fuses is high in precision such that the more accurate measurement can be implemented.

Abstract: The present invention discloses a gas pendulum style level posture sensing chip and its manufacturing method and a level posture sensor. The gas pendulum style level posture sensing chip includes: a semiconductor substrate; two sets of arm thermosensitive fuses formed on the surface of the semiconductor substrate, each set of the thermosensitive fuses including two thermosensitive fuses in parallel to each other, the two sets of thermosensitive fuses being vertical to each other; electrodes formed at the two ends of the thermosensitive fuses. For the level posture sensing chip and sensor provided by the present invention, the parallelism and verticality of the thermosensitive fuses is high in precision such that the more accurate measurement can be implemented.

Abstract: The present invention relates to a novel silicon micromechanical gyroscope, which is used in control technology field to measure pose measurement of a rotating body, such as aerobat, motor tire and drilling platform, wherein the novel silicon micromechanical gyroscope main includes a sensing element and a signal process circuit. The sensing element further comprises a silicon slice frame, a silicon slice, an upper electrode ceramics plate and a bottom electrode ceramics plate. The signal process circuit further comprises a signal detecting bridge circuit used as bridge arm of the capacitor sensing element, and a SCM signal process circuit with data process module. The novel silicon micromechanical gyroscope is able to replace a drive force from the drive conformation with a rotating force from the rotation of the rotating body so as to achieve a novel silicon micromechanical gyroscope without a drive conformation.

Abstract: The present invention relates to a gas pendulum inertial sensor, which is used in control technology field to detect pose measurement of motional body, such as ship craft and robot, wherein the inertial sensor main includes a gas pendulum angular velocity sensing element, a gas pendulum tilt sensing element and a signal process circuit, wherein the signal process circuit mainly comprises a bridge circuit, a amplify circuit, a filter circuit, and a SCM compensation circuit with a null position and sensitivity compensation program, a linearity and output compensation program, an acceleration interference offset subprogram, and an omnibearing tilt signal compensation program, whereby the SCM compensation circuit integral into a circuit board to replace a conventional hardware signal amplify circuit, a filter circuit and a compensation circuit.

Abstract: A piezoelectric quartz accelerometer includes a sensitive element, a signal processing circuit, a base, an outer case, and a socket, wherein the sensitive element includes two round piezoelectric quartz wafers, and a supporting frame, wherein the two round piezoelectric quartz wafers are symmetrically mounted on both sides of the center axial line of the supporting frame; the sensitive element further includes an axial shock buffer unit and a transverse retaining unit for protecting overload of the two round piezoelectric quartz wafers; the signal processing circuit includes an oscillation circuit for obtaining frequency signal, a frequency differential forming circuit for extracting signal, a phase lock and times frequency circuit for amplifying signal, compensating zero phase, compensating non-linearization and compensating temperature, and an output circuit.

Abstract: The present invention discloses a gas pendulum style level posture sensing chip and its manufacturing method and a level posture sensor. The gas pendulum style level posture sensing chip includes: a semiconductor substrate; two sets of arm thermosensitive fuses formed on the surface of the semiconductor substrate, each set of the thermosensitive fuses including two thermosensitive fuses in parallel to each other, the two sets of thermosensitive fuses being vertical to each other; electrodes formed at the two ends of the thermosensitive fuses. For the level posture sensing chip and sensor provided by the present invention, the parallelism and verticality of the thermosensitive fuses is high in precision such that the more accurate measurement can be implemented.

Abstract: A piezoelectric quartz accelerometer comprises a sensitive element, a signal processing circuit, a base, an outer case, and a socket, wherein said sensitive element comprising two round piezoelectric quartz wafers, and a supporting frame wherein said two round piezoelectric quartz wafers are symmetrically mounted on both sides of the centre axial line of said supporting frame; said sensitive element further comprises an axial shock buffer unit and a transverse retaining unit for protecting overload of said two round piezoelectric quartz wafers; said signal processing circuit comprises an oscillation circuit for obtaining frequency signal, frequency differential forming circuit for extracting signal, phase lock and times frequency circuit for amplifying signal, compensating zero phase, compensating non-linearization and compensating temperature, and output circuit.

Abstract: The present invention relates to a new piezoelectric quartz level sensor mainly applied in the attitude stabilized and control system of the aircraft, robot, vehicle, ship, oil drilling platform, construction, industrial automation equipment, radar, and satellite, comprising a sensitive element, signal processing circuit, base, outer case and socket. The piezoelectric quartz level sensor transfers the deflection angle of the object to the force exerted on two symmetrical mounted round piezoelectric quartz wafers, and then utilizing the prominent force sensitivity of the piezoelectric quartz, the level attitude parameter of an objected can be detected through the frequency variation due to the force exerted on the two piezoelectric quartz wafers. Therefore, the present invention can satisfy the demand of high stability and resolution, low non-linear degree, quick start time, wide measuring range and operating temperature, good ability to resist shock, and digital output.

Abstract: The present invention relates to a new piezoelectric quartz level sensor mainly applied in the attitude stabilized and control system of the aircraft, robot, vehicle, ship, oil drilling platform, construction, industrial automation equipment, radar, and satellite, comprising a sensitive element, signal processing circuit, base, outer case and socket. The piezoelectric quartz level sensor transfers the deflection angle of the object to the force exerted on two symmetrical mounted round piezoelectric quartz wafers, and then utilizing the prominent force sensitivity of the piezoelectric quartz, the level attitude parameter of an objected can be detected through the frequency variation due to the force exerted on the two piezoelectric quartz wafers. Therefore, the present invention can satisfy the demand of high stability and resolution, low non-linear degree, quick start time, wide measuring range and operating temperature, good ability to resist shock, and digital output.

Abstract: The present invention relates to a gas pendulum inertial sensor, which is used in control technology field to detect pose measurement of motional body, such as ship craft and robot, wherein the inertial sensor main includes a gas pendulum angular velocity sensing element, a gas pendulum tilt sensing element and a signal process circuit, wherein the signal process circuit mainly comprises a bridge circuit, a amplify circuit, a filter circuit, and a SCM compensation circuit with a null position and sensitivity compensation program, a linearity and output compensation program, an acceleration interference offset subprogram, and an omnibearing tilt signal compensation program, whereby the SCM compensation circuit integral into a circuit board to replace a conventional hardware signal amplify circuit, a filter circuit and a compensation circuit.

Abstract: The present invention relates to a novel silicon micromechanical gyroscope, which is used in control technology field to measure pose measurement of a rotating body, such as aerobat, motor tire and drilling platform, wherein the novel silicon micromechanical gyroscope main includes a sensing element and a signal process circuit. The sensing element further comprises a silicon slice frame, a silicon slice, an upper electrode ceramics plate and a bottom electrode ceramics plate. The signal process circuit further comprises a signal detecting bridge circuit used as bridge arm of the capacitor sensing element, and a SCM signal process circuit with data process module. The novel silicon micromechanical gyroscope is able to replace a drive force from the drive conformation with a rotating force from the rotation of the rotating body so as to achieve a novel silicon micromechanical gyroscope without a drive conformation.