Patents by Inventor Fuyumi Mawatari

Fuyumi Mawatari has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11572633
    Abstract: A tin-plated copper terminal material in which on a substrate made of copper or copper alloy, a nickel-or-nickel-alloy layer, a copper-tin alloy layer, and a tin layer are laminated in this order; in this material, the tin layer has an average thickness 0.2 ?m to 1.2 ?m inclusive; the copper-tin alloy layer is a compound alloy layer in which Cu6Sn5 is a main ingredient and part of copper in the Cu6Sn5 is substituted with nickel, and an average crystal grain size is 0.2 ?m to 1.5 ?m inclusive; part of the copper-tin alloy layer appears on a surface of the tin layer and tin solidification parts exist like islands; and the tin solidification parts have an average diameter 10 ?m to 1000 ?m inclusive in a direction along the surface of the tin layer and an area ratio to the surface of the tin layer 1% to 90% inclusive.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: February 7, 2023
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Fuyumi Mawatari, Kazunari Maki, Shinichi Funaki, Yuki Inoue, Kiyotaka Nakaya
  • Publication number: 20210108325
    Abstract: A tin-plated copper terminal material in which on a substrate made of copper or copper alloy, a nickel-or-nickel-alloy layer, a copper-tin alloy layer, and a tin layer are laminated in this order; in this material, the tin layer has an average thickness 0.2 ?m to 1.2 ?m inclusive; the copper-tin alloy layer is a compound alloy layer in which Cu6Sn5 is a main ingredient and part of copper in the Cu6Sn5 is substituted with nickel, and an average crystal grain size is 0.2 ?m to 1.5 ?m inclusive; part of the copper-tin alloy layer appears on a surface of the tin layer and tin solidification parts exist like islands; and the tin solidification parts have an average diameter 10 ?m to 1000 ?m inclusive in a direction along the surface of the tin layer and an area ratio to the surface of the tin layer 1% to 90% inclusive.
    Type: Application
    Filed: March 29, 2019
    Publication date: April 15, 2021
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Fuyumi Mawatari, Kazunari Maki, Shinichi Funaki, Yuki Inoue, Kiyotaka Nakaya
  • Patent number: 9647185
    Abstract: A light emitting element having a light emitting layer, an electro-conductive reflection film that reflects light emitted from the light emitting layer and a substrate in this order, wherein the electro-conductive reflection film contains metal nanoparticles.
    Type: Grant
    Filed: November 10, 2011
    Date of Patent: May 9, 2017
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Fuyumi Mawatari, Youji Kondou, Reiko Izumi, Yoshimasa Hayashi, Kazuhiko Yamasaki
  • Patent number: 9281421
    Abstract: A conductive reflective film has a silver nanoparticle-sintered film with a surface coating composition containing a hydrolysate of a metal alkoxide wet-coated thereto. The coated film is then fired. Also provided is a method of manufacturing the conductive reflective film comprising the steps of coating a surface coating composition containing a hydrolysate of a metal alkoxide on a silver nanoparticle-sintered film using a wet coating method, and firing the silver nanoparticle-sintered film having the coated film. The conductive reflective film provides improved adhesion properties with respect to a base material while maintaining a high reflectivity and a high conductivity of a silver nanoparticle-sintered film.
    Type: Grant
    Filed: February 15, 2013
    Date of Patent: March 8, 2016
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kazuhiko Yamasaki, Fuyumi Mawatari, Satoko Higano
  • Publication number: 20130234191
    Abstract: A light emitting element having a light emitting layer, an electro-conductive reflection film that reflects light emitted from the light emitting layer and a substrate in this order, wherein the electro-conductive reflection film contains metal nanoparticles.
    Type: Application
    Filed: November 10, 2011
    Publication date: September 12, 2013
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Fuyumi Mawatari, Youji Kondou, Reiko Izumi, Yoshimasa Hayashi, Kazuhiko Yamasaki