Abstract: A robot system includes a robot and a robot controller that controls an operation and a temperature of the robot. The robot includes a first joint, a second joint, a first drive mechanism that drives the first joint, and a second drive mechanism that drives the second joint. A temperature adjuster includes a temperature sensor that measures a first temperature of the first drive mechanism, a heater that heats the first drive mechanism, a temperature sensor that measures a second temperature of the second drive mechanism, a heater that heats the second drive mechanism, and an adjustment section that controls the heater so that the first temperature of the first drive mechanism approaches a first target value set in advance, and that controls the heater so that the second temperature of the second drive mechanism approaches a second target value set in advance.

Abstract: A control method for controlling a robot includes a measuring step of measuring a temperature of measurement target of drive mechanisms from among a plurality of the drive mechanisms at predetermined time intervals by a temperature sensor included in a temperature control device, a heating step of heating the plurality of the drive mechanisms by heaters included in the temperature control device, a stopping step of stopping an operation of the plurality of the drive mechanisms by a robot controller, when the temperature of the measurement target falls below a set stop temperature, and a resuming step of resuming the operation of the plurality of drive mechanisms when the temperature of the measurement target is equal to or higher than a set resume temperature after the robot controller 500 has performed the stopping step.

Abstract: An electronic component handler includes a tray having a pocket in which an IC device is placed, and a first device transport head that holds and transports the IC device to the pocket, wherein the first device transport head includes a light emitting portion that emits a light to the pocket, a light focusing portion that adjusts a spot diameter of the light emitted by the light emitting portion, and a light receiving portion that receives the light reflected by the pocket.

Abstract: There is provided an electronic component handler for transporting an electronic component, the handler including a shuttle having a placement surface on which the electronic component is placed and moving from a first position to a second position, and a positioning unit provided in the shuttle and positioning the electronic component by coming into contact with the electronic component placed on the placement surface, in which the positioning unit has a first positioning member and a second positioning member that are driven to move or rotate with respect to the shuttle, when the shuttle is located at the first position, the electronic component is placed on the placement surface, and a distance between the first positioning member and the second positioning member when the shuttle is located at the first position is longer than a distance between the first positioning member and the second positioning member when the shuttle is located at the second position.

Abstract: An electronic component handler includes a tray having a pocket in which an IC device is placed, and a first device transport head that holds and transports the IC device to the pocket, wherein the first device transport head includes a light emitting portion that emits a light to the pocket, a light focusing portion that adjusts a spot diameter of the light emitted by the light emitting portion, and a light receiving portion that receives the light reflected by the pocket.

Abstract: An electronic component handler includes a container mount member on which a tray with an IC device mounted thereon is placed, a support member as a part of a reinforcing member supporting the container mount member and extending along a first axis, a first transport robot having a first device transport head that holds the IC device and moves along a second rail, and a first sensor placed in the first device transport head, wherein a first marker and a second marker are provided on the support member and positions of the first marker and the second marker are detected by the first sensor.

Abstract: An electronic component handler includes an electronic component transporter transporting an electronic component in an arrangement state where a shuttle plate is arranged, the shuttle plate having a recess receiving the electronic component, a light source casting light, a light receiver receiving the light, a detector detecting presence/absence of the electronic component in the recess, and a negative pressure generator putting the recess under a negative pressure. The shuttle plate has a first flow path. The electronic component transporter has: a shuttle plate fastener having a second flow path communicated with the first flow path in the arrangement state and having the shuttle plate fixed thereto in the arrangement state, a transmission member sealing the second flow path and transmitting the light, and a driver driving the shuttle plate fastener. The negative pressure generator is coupled to the second flow path and sucks the electronic component in the recess.

Abstract: There is provided an electronic component handler for transporting an electronic component, the handler including a shuttle having a placement surface on which the electronic component is placed and moving from a first position to a second position, and a positioning unit provided in the shuttle and positioning the electronic component by coming into contact with the electronic component placed on the placement surface, in which the positioning unit has a first positioning member and a second positioning member that are driven to move or rotate with respect to the shuttle, when the shuttle is located at the first position, the electronic component is placed on the placement surface, and a distance between the first positioning member and the second positioning member when the shuttle is located at the first position is longer than a distance between the first positioning member and the second positioning member when the shuttle is located at the second position.

Abstract: An electronic component handler includes: an electronic component transporter transporting an electronic component in an arrangement state where a shuttle plate is arranged, the shuttle plate having a recess receiving the electronic component; a light source casting light; a light receiver receiving the light; a detector detecting presence/absence of the electronic component in the recess; and a negative pressure generator putting the recess under a negative pressure. The shuttle plate has a first flow path. The electronic component transporter has: a shuttle plate fastener having a second flow path communicated with the first flow path in the arrangement state and having the shuttle plate fixed thereto in the arrangement state; a transmission member sealing the second flow path and transmitting the light; and a driver driving the shuttle plate fastener. The negative pressure generator is coupled to the second flow path and sucks the electronic component in the recess.

Abstract: An optical scale includes a tabular base material and an optical pattern provided above a principal plane of the base material and including a first region where a resin layer including photosensitive resin is formed and a second region where the resin layer is not formed. The optical pattern includes a pigment.

Abstract: A handler includes: a rotating section which is a holding unit mounting section which can take a mounted state in which a holding unit for holding an IC device is mounted; and a transportation mechanism which transports the IC device held by the holding unit. The rotating section includes a heat generation section which generates heat and a heating flow path through which fluid which is heated by the heat generation section and is used for heating of the IC device passes.

Abstract: A handler includes: a rotating section which is a holding unit mounting section which can take a mounted state in which a holding unit for holding an IC device is mounted; and a transportation mechanism which transports the IC device held by the holding unit. The rotating section includes a heat generation section which generates heat and a heating flow path through which fluid which is heated by the heat generation section and is used for heating of the IC device passes.