Patents by Inventor Fwu-Huei Wu

Fwu-Huei Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bimetallic insert fin for high conduction cooling structure
    Patent number: 5131456
    Abstract: A high conduction cooling structure useful for dissipating heat from integrated circuit devices includes a cooling base (10), a bulk heat transfer element (18), adjacent spaced apart cooling fins (14 and 16), and a bimetallic strip (22). The cooling base (10) is positioned in heat transfer relationship with an integrated circuit device and as it increases in temperature, the bimetallic strip (22) flexes outwardly and contacts the cooling fins (14 and 16). The contact created with the cooling fins (14 and 16) allows for more efficient transfer of thermal energy.
    Type: Grant
    Filed: July 1, 1991
    Date of Patent: July 21, 1992
    Assignee: IBM Corporation
    Inventor: Fwu-Huei Wu