Abstract: A device for manipulating an implant includes a handle coupled to a guide extending from the handle to a distal end. The device includes an engagement mechanism disposed at the distal end of the guide and configured to engage an implant. The device includes a first actuator disposed on the handle and coupled to the engagement mechanism. The first actuator causes the engagement mechanism to engage the implant. The device includes an air chamber disposed in an interior chamber of the handle and configured to hold air. The device includes a lumen coupled to the air chamber and extending along the guide to the distal end. The lumen includes an air channel extending through the lumen. The device includes a second actuator disposed on the handle. The second actuator causes the air chamber to deliver the air, via the air channel, to the distal end.

Abstract: A device for manipulating an implant includes a handle coupled to a guide extending from the handle to a distal end. The device includes an engagement mechanism disposed at the distal end of the guide and configured to engage an implant. The device includes a first actuator disposed on the handle and coupled to the engagement mechanism. The first actuator causes the engagement mechanism to engage the implant. The device includes an air chamber disposed in an interior chamber of the handle and configured to hold air. The device includes a lumen coupled to the air chamber and extending along the guide to the distal end. The lumen includes an air channel extending through the lumen. The device includes a second actuator disposed on the handle. The second actuator causes the air chamber to deliver the air, via the air channel, to the distal end.

Abstract: A connector gap between a module connector mating surface and the backplane connector of a chassis may be eliminated through a mechanism that forcefully pushes (or pulls) the module towards the backplane and/or forcefully pushes (or pulls) the backplane toward the module. A spring-loaded or resilient element may be used to fasten the module in a way that effectively fills any designed-in and tolerance-induced gap in the connector interface, allowing the connector to fully seat. In addition, a gasket or other compressible member may be included at the connector mating interface. The gap in the connector interface may be reduced by introducing adjustable card cage members that are capable of being set during the assembly or manufacturing process using special alignment fixtures. The gap in the connector interface may also be reduced by introducing a higher tolerance capable manufacturing process, such as machining, to the card cage sub-assembly.

Abstract: A technique can consistently achieve thicknesses of ? 50 µm for corneal tissue for for Descemet stripping automated endothelial keratoplasty (DSAEK). Grafts with thicknesses of ? 50 µm are also known as nanothin DSAEK (NT-DSAEK) grafts. Evidence shows that using thinner DSAEK grafts, particularly NT-DSAEK grafts, can significantly improve visual outcomes. According to an example embodiment, a method for producing a corneal graft includes drying a donor cornea to cause a pre-cut thickness of the donor cornea to decrease. The method includes, concurrently with drying the donor cornea, determining pre-cut thickness measurements for the donor cornea. The method includes, in response to the precut thickness measurements indicating the pre-cut thickness of the donor cornea has decreased to a predetermined value, cutting the donor cornea to a post-cut thickness of ? 100 µm, or more particularly ? 50 µm, to produce a corneal graft.

Abstract: A technique can consistently achieve thicknesses of ?50 ?m for corneal tissue for Descemet stripping automated endothelial keratoplasty (DSAEK). Grafts with thicknesses of ?50 ?m are also known as nanothin DSAEK (NT-DSAEK) grafts. Evidence shows that using thinner DSAEK grafts, particularly NT-DSAEK grafts, can significantly improve visual outcomes. According to an example embodiment, a method for producing a corneal graft includes drying a donor cornea to cause a pre-cut thickness of the donor cornea to decrease. The method includes, concurrently with drying the donor cornea, determining pre-cut thickness measurements for the donor cornea. The method includes, in response to the pre-cut thickness measurements indicating the pre-cut thickness of the donor cornea has decreased to a predetermined value, cutting the donor cornea to a post-cut thickness of ?100 ?m, or more particularly ?50 ?m, to produce a corneal graft.

Abstract: Various types of electronic devices may be mounted in a chassis in order to facilitate interfacing with the devices, containing the devices, provide cooling systems which may remove heat from the electronic devices, etc. Delivering adequate cooling air flow to each electronic device in a chassis may be an important issue for the proper functioning, lifetime, or other characteristics of electronic devices contained in a chassis. Some electronic devices may be particularly challenging to cool due to various design characteristics. Other electronic devices may have other requirements that are not well served by existing chassis designs. For example, some electronic devices may benefit from additional electrical and/or thermal connections. Embodiments presented herein describe a novel design for a modular card cage accessory that may be configured to modify air flow and/or to meet particular requirements of an electronic device in a chassis, among various possibilities.

Abstract: Various types of electronic devices may be mounted in a chassis in order to facilitate interfacing with the devices, containing the devices, provide cooling systems which may remove heat from the electronic devices, etc. Delivering adequate cooling air flow to each electronic device in a chassis may be an important issue for the proper functioning, lifetime, or other characteristics of electronic devices contained in a chassis. Some electronic devices may be particularly challenging to cool due to various design characteristics. Other electronic devices may have other requirements that are not well served by existing chassis designs. For example, some electronic devices may benefit from additional electrical and/or thermal connections. Embodiments presented herein describe a novel design for a modular card cage accessory that may be configured to modify air flow and/or to meet particular requirements of an electronic device in a chassis, among various possibilities.

Abstract: A connector gap between a module connector mating surface and the backplane connector of a chassis may be eliminated through a mechanism that forcefully pushes (or pulls) the module towards the backplane and/or forcefully pushes (or pulls) the backplane toward the module. A spring-loaded or resilient element may be used to fasten the module in a way that effectively fills any designed-in and tolerance-induced gap in the connector interface, allowing the connector to fully seat. In addition, a gasket or other compressible member may be included at the connector mating interface. The gap in the connector interface may be reduced by introducing adjustable card cage members that are capable of being set during the assembly or manufacturing process using special alignment fixtures. The gap in the connector interface may also be reduced by introducing a higher tolerance capable manufacturing process, such as machining, to the card cage sub-assembly.

Abstract: A device for manipulating an implant includes a handle coupled to a guide extending from the handle to a distal end. The device includes an engagement mechanism disposed at the distal end of the guide and configured to engage an implant. The device includes a first actuator disposed on the handle and coupled to the engagement mechanism. The first actuator causes the engagement mechanism to engage the implant. The device includes an air chamber disposed in an interior chamber of the handle and configured to hold air. The device includes a lumen coupled to the air chamber and extending along the guide to the distal end. The lumen includes an air channel extending through the lumen. The device includes a second actuator disposed on the handle. The second actuator causes the air chamber to deliver the air, via the air channel, to the distal end.

Abstract: An ion source assembly is described that includes an electron source configured to inject electrons into an ion volume to ionize an atom or molecule in the ion volume, wherein the electron source includes a filament. A lens electrode is positioned adjacent the electron source and includes an opening configured to pass electrons therethrough from the electron source into the ion volume. A supply voltage source is coupled to the filament and configured to supply a first voltage to the filament, wherein the first voltage is operable to ionize the molecules in the ion volume. Further, a bias voltage source is coupled to the supply voltage source and configured to supply a bias voltage to the lens electrode. Electrons striking the lens electrode are thereafter returned to the filament.

Abstract: An ion source assembly is described that includes an electron source configured to inject electrons into an ion volume to ionize an atom or molecule in the ion volume, wherein the electron source includes a filament. A lens electrode is positioned adjacent the electron source and includes an opening configured to pass electrons therethrough from the electron source into the ion volume. A supply voltage source is coupled to the filament and configured to supply a first voltage to the filament, wherein the first voltage is operable to ionize the molecules in the ion volume. Further, a bias voltage source is coupled to the supply voltage source and configured to supply a bias voltage to the lens electrode. Electrons striking the lens electrode are thereafter returned to the filament.

Abstract: A device for manipulating an implant includes a handle coupled to a guide extending from the handle to a distal end. The device includes an engagement mechanism disposed at the distal end of the guide and configured to engage an implant. The device includes a first actuator disposed on the handle and coupled to the engagement mechanism. The first actuator causes the engagement mechanism to engage the implant. The device includes an air chamber disposed in an interior chamber of the handle and configured to hold air. The device includes a lumen coupled to the air chamber and extending along the guide to the distal end. The lumen includes an air channel extending through the lumen. The device includes a second actuator disposed on the handle. The second actuator causes the air chamber to deliver the air, via the air channel, to the distal end.

Abstract: Various types of electronic devices may be mounted in a chassis in order to facilitate interfacing with the devices, containing the devices, provide cooling systems which may remove heat from the electronic devices, etc. Delivering adequate cooling air flow to each electronic device in a chassis may be an important issue for the proper functioning, lifetime, or other characteristics of electronic devices contained in a chassis. Some electronic devices may be particularly challenging to cool due to various design characteristics. Other electronic devices may have other requirements that are not well served by existing chassis designs. For example, some electronic devices may benefit from additional electrical and/or thermal connections. Embodiments presented herein describe a novel design for a modular card cage accessory that may be configured to modify air flow and/or to meet particular requirements of an electronic device in a chassis, among various possibilities.

Abstract: A technique can consistently achieve thicknesses of ?50 ?m for corneal tissue for Descemet stripping automated endothelial keratoplasty (DSAEK). Grafts with thicknesses of ?50 ?m are also known as nanothin DSAEK (NT-DSAEK) grafts. Evidence shows that using thinner DSAEK grafts, particularly NT-DSAEK grafts, can significantly improve visual outcomes. According to an example embodiment, a method for producing a corneal graft includes drying a donor cornea to cause a pre-cut thickness of the donor cornea to decrease. The method includes, concurrently with drying the donor cornea, determining pre-cut thickness measurements for the donor cornea. The method includes, in response to the pre-cut thickness measurements indicating the pre-cut thickness of the donor cornea has decreased to a predetermined value, cutting the donor cornea to a post-cut thickness of ?100 ?m, or more particularly ?50 ?m, to produce a corneal graft.

Abstract: An optical component array and method of making an optical component array includes a plurality of optical components useful for projection devices or other optical devices.

Abstract: Various types of electronic devices may be mounted in a chassis in order to facilitate interfacing with the devices, containing the devices, provide cooling systems which may remove heat from the electronic devices, etc. Delivering adequate cooling air flow to each electronic device in a chassis may be an important issue for the proper functioning, lifetime, or other characteristics of electronic devices contained in a chassis. Embodiments presented herein describe a novel design for an air flow straightener that is configured for insertion within the chassis to straighten the airflow. In some embodiments, the grating is comprised of long dividers and shorter dividers that are predominantly oriented perpendicularly to each other, resulting in a rectangular grating. Including such a grating in a chassis may improve the uniformity and performance of the cooling system.

Abstract: Various types of electronic devices may be mounted in a chassis in order to facilitate interfacing with the devices, containing the devices, provide cooling systems which may remove heat from the electronic devices, etc. Delivering adequate cooling air flow to each electronic device in a chassis may be an important issue for the proper functioning, lifetime, or other characteristics of electronic devices contained in a chassis. Embodiments presented herein describe a novel design for an air flow straightener that is configured for insertion within the chassis to straighten the airflow. In some embodiments, the grating is comprised of long dividers and shorter dividers that are predominantly oriented perpendicularly to each other, resulting in a rectangular grating. Including such a grating in a chassis may improve the uniformity and performance of the cooling system.

Abstract: A device for manipulating an implant includes a handle coupled to a guide extending from the handle to a distal end. The device includes an engagement mechanism disposed at the distal end of the guide and configured to engage an implant. The device includes a first actuator disposed on the handle and coupled to the engagement mechanism. The first actuator causes the engagement mechanism to engage the implant. The device includes an air chamber disposed in an interior chamber of the handle and configured to hold air. The device includes a lumen coupled to the air chamber and extending along the guide to the distal end. The lumen includes an air channel extending through the lumen. The device includes a second actuator disposed on the handle. The second actuator causes the air chamber to deliver the air, via the air channel, to the distal end.

Abstract: The present disclosure provides an optical component array and method of making an optical component array that can include a plurality of optical components useful for projection devices or other optical devices. The optical component array can be fabricated such that individual optical components having several elements can be assembled in a massively parallel manner and then singulated as individual optical components, and can result in a large reduction in manufacturing cost.

Abstract: The present disclosure provides an optical component array and method of making an optical component array that can include a plurality of optical components useful for projection devices or other optical devices. The optical component array can be fabricated such that individual optical components having several elements can be assembled in a massively parallel manner and then singulated as individual optical components, and can result in a large reduction in manufacturing cost.