Abstract: This invention relates to a Hot Melt Glue Conveying System and in particular to a system for improving the material handling of thermoplastic adhesive chips to provide the uninterrupted flow of hot melt glue to packaging production lines. This invention reveals both a system and a method which improves the material handling efficiency and reduces the maintenance and down-time of a system for conveying solid glue chips or particles from a bulk source in the proper continuous glue volume to a glue melting apparatus. This system has filters at various points in the conveying system to screen the particle size of material flowing through and to minimize foreign particles in the system. This conveying system includes sensing devices that determine the material flow volume and vacuum at various gates, valves and hoppers in the system and sends an electronic signal to the control unit of those readings.