Patents by Inventor G. Cox

G. Cox has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070006435
    Abstract: The present invention relates to methods of forming multilayer structures and the structures themselves. In one embodiment, a method of forming a multilayer structure comprising: providing a dielectric composition comprising: paraelectric filler and polymer wherein said paraelectric filler has a dielectric constant between 50 and 150; applying said dielectric composition to a carrier film thus forming a multilayer film comprising a dielectric layer and carrier film layer; laminating said multilayer film to a circuitized core wherein the dielectric layer of said multilayer film is facing said circuitized core; and removing said carrier film layer from said dielectric layer prior to processing; applying a metallic layer to said dielectric layer wherein said circuitized core, dielectric layer and metallic layer form a planar capacitor; and processing said planar capacitor to form a multilayer structure.
    Type: Application
    Filed: June 13, 2006
    Publication date: January 11, 2007
    Inventors: Sounak Banerji, G. Cox, Karl Dietz
  • Publication number: 20060133011
    Abstract: The present invention relates to a dielectric composition comprising: paraelectric filler; and polymer wherein said paraelectric filler has a dielectric constant between 50 and 150.
    Type: Application
    Filed: December 15, 2005
    Publication date: June 22, 2006
    Inventor: G. Cox
  • Publication number: 20060082982
    Abstract: A capacitive/resistive device provides both resistive and capacitive functions. The capacitive/resistive device may be embedded within a layer of a printed wiring board. Embedding the capacitive/resistive device conserves board surface real estate, and reduces the number of solder connections, thereby increasing reliability. Conserves board surface real estate, and reduces the number of solder connections, thereby increasing reliability.
    Type: Application
    Filed: October 18, 2004
    Publication date: April 20, 2006
    Inventors: William Borland, G. Cox, David McGregor