Abstract: Invention z-axis interconnection structures provide a means to mechanically and electrically interconnect layers of metallization in electronic substrates reliably and in any configuration. Invention z-axis interconnection structures comprise a novel bonding film and conductive paste and one- and two-piece building block structures formed therefrom.

Abstract: The present invention provides conductive metal compositions for electronic applications, and methods of preparation and uses thereof. More specifically, the present invention provides metallic particle transient liquid phase sintering compositions containing blended formulations of metal and metal alloy components that form interconnected conductive metallurgical networks with increased stability, resistance to thermal stress and ability to mitigate CTE mismatch between materials.

Abstract: Invention z-axis interconnection structures provide a means to mechanically and electrically interconnect layers of metallization in electronic substrates reliably and in any configuration. Invention z-axis interconnection structures comprise a novel bonding film and conductive paste and one- and two-piece building block structures formed therefrom.

Abstract: The present invention provides electrically and thermally conductive compositions for forming interconnections between electronic elements. Invention compositions comprise three or more metal or metal alloy particle types and an organic vehicle comprising a flux that is application specific. The first particle type includes a reactive high melting point metal that reacts with a reactive low melting point metal(s) in the other particles to form intermetallic species. The reactive low melting point metal(s) of the invention are provided in two distinct particle forms. The first reactive low melting point metal particle includes a carrier that facilitates the reaction with the reactive high melting point metal. The second reactive low melting point metal particle acts primarily as a source of the reactive low melting point metal.

Abstract: The present invention provides conductive metal compositions for electronic applications, and methods of preparation and uses thereof. More specifically, the present invention provides metallic particle transient liquid phase sintering compositions containing blended formulations of metal and metal alloy components that form interconnected conductive metallurgical networks with increased stability, resistance to thermal stress and ability to mitigate CTE mismatch between materials.

Abstract: The present invention provides electrically and thermally conductive compositions for forming interconnections between electronic elements. Invention compositions comprise three or more metal or metal alloy particle types and an organic vehicle comprising a flux that is application specific. The first particle type includes a reactive high melting point metal that reacts with a reactive low melting point metal(s) in the other particles to form intermetallic species. The reactive low melting point metal(s) of the invention are provided in two distinct particle forms. The first reactive low melting point metal particle includes a carrier that facilitates the reaction with the reactive high melting point metal. The second reactive low melting point metal particle acts primarily as a source of the reactive low melting point metal.

Abstract: This invention presents a series of glasses which possess low softening points, high resistance to recrystallization and good durability in the presence of moisture. The glasses are contained within oxides of silver, vanadium, tellurium, and lead and have glass transition temperatures below 260.degree. C., and are useful in electronic applications such as die attach adhesives and sealing glasses.