Abstract: An improved electrical component, such as a fuse, is provided. The component or fuse includes an insulative housing and at least one conductive end cap secured to the housing. The end cap is secured to the housing, at least in part, via a solder that expands upon cooling or upon transitioning from a liquid to a solid state. The solder in one embodiment includes bismuth, which provides such expansion qualities. Bismuth also has a relatively high melting temperature and may be used, alone or in combination with other higher melting temperature metals, such as antimony, in applications employing external lead-free solders, which typically have higher melting temperatures than leaded solders.