Patents by Inventor G. James Estep

G. James Estep has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic hybrid circuit package
    Patent number: 4272644
    Abstract: A hybrid package which includes a plastic shell having an integral interior configuration for support of a ceramic substrate and terminal pins, and an encapsulate for rigid retention of the pins and for sealing of the package.
    Type: Grant
    Filed: September 27, 1979
    Date of Patent: June 9, 1981
    Assignee: Hybrid Systems Corporation
    Inventors: Ronald C. Visser, G. James Estep, Alan S. Esbitt