Abstract: The invention relates to methods and devices for producing one or more low-particle layers on substrates in a vacuum. The layers are deposited onto the substrate from a cylindrical source material, optionally together with a reactive gas component, by means of magnetron sputtering. The layer is deposited against the force of gravity in a sputter-up method. During the method or within the device, the structure or stochiometric atomic composition of the layers can optionally be modified using a plasma source. Multiple sputtering sources with different source materials can be provided in the device such that multiple layers of different compositions can be applied on the substrate at a high speed in one process.

Abstract: The invention relates to methods and devices for producing one or more low-particle layers on substrates in a vacuum. The layers are deposited onto the substrate from a cylindrical source material, optionally together with a reactive gas component, by means of magnetron sputtering. The layer is deposited against the force of gravity in a sputter-up method. During the method or within the device, the structure or stochiometric atomic composition of the layers can optionally be modified using a plasma source. Multiple sputtering sources with different source materials can be provided in the device such that multiple layers of different compositions can be applied on the substrate at a high speed in one process.

Abstract: A process is provided for sputter-induced precipitation of metal oxide layers on substrates by means of a reactive sputter process. The plasma charge acting upon the target to be evaporated is provided with electric power selected such that the metal oxide layers precipitated on the substrates to be coated are deposited at a precipitation rate of ≧4 nm/s. During the coating process the substrate to be coated is arranged stationary in relation to the target material to be evaporated. The electrodes are connected in a conductive manner to the outputs of an alternating current source whereby the alternating frequency of the alternating current provided for the electrical supply of the plasma discharge is selected between 10 kHz and 80 kHz. Particularly preferred is that the precipitated oxide layer is a TiO2 layer or an SiO2 layer.

Abstract: A process is provided for sputter-induced precipitation of metal oxide layers on substrates by means of a reactive sputter process. The plasma charge acting upon the target to be evaporated is provided with electric power selected such that the metal oxide layers precipitated on the substrates to be coated are deposited at a precipitation rate of ≧4 nm/s. During the coating process the substrate to be coated is arranged stationary in relation to the target material to be evaporated. The electrodes are connected in a conductive manner to the outputs of an alternating current source whereby the alternating frequency of the alternating current provided for the electrical supply of the plasma discharge is selected between 10 kHz and 80 kHz. Particularly preferred is that the precipitated oxide layer is a TiO2 layer or an SiO2 layer.

Abstract: In an apparatus for the coating of substrates in a vacuum with rotatable substrate carriers (15,16,20) and with a loading and an unloading station (8 or 9), two vacuum chambers (3,4) are provided with several coating stations (6,7 or 10 to 14), directly next to one another, wherein a rotatable transport arm (15 or 16) is accommodated in each of the two chambers (3, 4), and the transport planes of the two transport arms (15,16) are aligned with one another. In the separation area of the two chambers (3,4), an air lock is provided with a corresponding transfer apparatus (5) with two transport arms (15,16), whose rotary plate (20) is provided with substrate storage unit (21,22) and projects about halfway into one chamber (3) and halfway into the other chamber (4), wherein one chamber (3) has both the loading as well as the unloading station (8 or 9).

Abstract: Method and an apparatus for coating a substrate from electrically conductive targets (3, 4) in a reactive atmosphere, comprising a power source (12, 13, 14) which is connected to cathodes (1, 2) disposed in an evacuable coating chamber (15) and cooperating electrically with the targets (3, 4), two anodes (5, 6) electrically separated from one another and from the sputtering chamber (15) being provided, which lie in a plane between the cathodes (1, 2) and the substrate (7), the two output terminals (12a, 12b) of the secondary winding of a transformer (12) connected, with interposition of a choke coil (14), to a medium frequency generator (13) being connected each to a cathode (1 and 2, respectively) via two supply lines (20, 21) and the two supply lines (20, 21) being connected via a branch line (22) into which a resonant circuit is inserted, and each of the two supply lines (20, 21) being coupled both via a first network (16 and 17, respectively) to the coating chamber and via a corresponding second network (

Abstract: In a sputtering cathode arrangement according to the magnetron principle for the coating of a flat circular substrate, with a circular ring-shaped target and an outer mask and inner mask disposed between the target and the substrate, a magnet system with a yoke plate being disposed in back of the target for the production of the magnetron effect, the inner mask is fastened to a mask holder which is brought through the center of the target, the magnet system with the yoke plate (8) being disposed for rotation about an axis of rotation (M) going through the center of the target, and consisting of at least two magnet arrangements (9,9', . . . ; 10,10', . . .