Patents by Inventor Günter Deisenhofer

Günter Deisenhofer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110150568
    Abstract: A clamping device (10) is configured to apply opposite clamping forces in both a first (x-axis) and second (z-axis) traverse direction when being compressed in a longitudinal direction (y-axis) to fix elements to another. The device includes clamping means able to transform compressive movements and/or forces in said longitudinal direction into expanding movements and/or forces in both said traverse directions until the expansion is stopped by abutment in said traverse directions upon adjacent elements for application of clamping forces. Additionally, the compressive force used to generate the clamping forces in both said traverse directions allows for attaching the device to a support for fixing an element in all three directions by one single manual operating action.
    Type: Application
    Filed: May 21, 2008
    Publication date: June 23, 2011
    Inventor: Guenter Deisenhofer
  • Patent number: 7462043
    Abstract: An aluminum enclosure of an electronic device is used in a corrosion environment. A long-term low impedance ground connection is needed because of security and EMC reasons. While common surface protection for aluminum in corrosion environments as for example polyurethane paint is not conductive, a stainless steel connector is provided which comprises a head portion and a bolt portion. The bolt portion is inserted into a bore of the enclosure or frame. An annular rib provided on the back side of the head portion defines a cutting edge which cuts into the surface of the aluminum enclosure and provides a gas-tight electrical contact. The front surface of the stainless steel head of the electrical connector element provides a metallic surface for connecting ground wires or other conductors.
    Type: Grant
    Filed: December 15, 2006
    Date of Patent: December 9, 2008
    Assignee: GE Fanuc Embedded Systems, Inc.
    Inventor: Günter Deisenhofer