Patents by Inventor Günter Herklotz

Günter Herklotz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6610086
    Abstract: A radially expandable support structure is presented, for keeping open lumina within a body, in particular a blood vessel, having a tube-shaped structure that has at least two partial structures, with a wall surface that extends between a first and a second end, which has several cut out areas, in particular, slits, which are essentially oriented parallel to the longitudinal axis of the tube-shaped structure. At least one of the partial structures (11) extend without interruption in the axial direction generally from the first end to the second end of the tube-shaped structure. A first partial structure (1, 2) can be expanded at least in the radial direction and has at least one radial-expansion component. The individual radial expansion components (12, 13) are arranged as a helix or in a helix shape. A second partial structure (11) is generally almost rigid in the axial direction.
    Type: Grant
    Filed: June 28, 1999
    Date of Patent: August 26, 2003
    Assignee: W. C. Heraeus GmbH & Co. KG
    Inventors: Wulf Kock, Günter Herklotz, Matthias Frericks, Jens Trötzschel
  • Patent number: 6355363
    Abstract: A support structure is provided for holding open lumina, the support structure having a stainless steel substrate and a platinum layer forming the surface of the structure. The structure has at least one gold layer arranged between the substrate and the platinum layer. The platinum layer is preferably applied with a pulsed current with current reversal, in order to avoid or reduce brittleness occurring by absorption of hydrogen during galvanic deposition of platinum. Such a support structure (stent) substantially withstands the high mechanical stresses, particularly bending and torsional forces that occur during application, without the formation of significant tears in the platinum layer.
    Type: Grant
    Filed: February 16, 2000
    Date of Patent: March 12, 2002
    Assignee: W. C. Hereaus GmbH & Co. KG
    Inventors: Günter Herklotz, Frank Krüger, Thomas Frey, Thomas Giesel
  • Patent number: 6352634
    Abstract: A method for the manufacture of a leadless substrate with a basic body made of copper or copper base alloy, a solder layer applied to at least one portion of the basic body and made of metals belonging to the group of gold, gold alloy, silver, silver alloy, palladium, and palladium alloy, as well as an intermediate layer arranged between the basic body and the solder layer and made of nickel or nickel alloy, wherein the solder layer consists of at least two separate layers made of different metals and wherein the intermediate layer and the separate layers are deposited by electroplating, characterized in that at least one separate layer is made of silver or silver alloy.
    Type: Grant
    Filed: February 1, 2000
    Date of Patent: March 5, 2002
    Assignee: W. C. Heraeus GmbH & Co. KG
    Inventors: Heinz Förderer, Thomas Frey, Günter Herklotz
  • Patent number: 6264688
    Abstract: A radially expandable support structure is provided, for keeping open lumina within a body, in particular a blood vessel, having a tube-shaped body that has at least two partial structures, with a wall surface that extends between a first and a second end, which has several cut out areas, in particular, slits, which are essentially oriented parallel to the longitudinal axis of the tube-shaped structure. At least one partial structure (11) extends without interruption in the axial direction generally from the first end to the second end of the tube-shaped body. The first partial structure (1, 2) can be expanded at least in the radial direction and has at least one radial-expansion component. Individual radial expansion components (12, 13) are arranged as rings or in a ring shape, and the second partial structure (11) is almost rigid in the axial direction.
    Type: Grant
    Filed: June 28, 1999
    Date of Patent: July 24, 2001
    Assignee: W. C. Heraeus GmbH & Co. KG
    Inventors: Günter Herklotz, Jens Trötzschel
  • Patent number: 6242106
    Abstract: A fine wire made of an alloy of gold which contains 0.6 to 2 weight % of nickel, or an alloy of gold which contains 0.1 to 2 weight % of nickel, 0.0001 to 0.1 weight % of alkaline earth metal and/or rare earth metal, and optionally 0.1 to 1.0 weight % of platinum and/or palladium . The fine wire is distinguished by a favorable electrical conductivity and a good ratio of strength to elongation. The fine wire is suitable both for wire bonding of semiconductor devices and for producing the ball bumps of flip-chips.
    Type: Grant
    Filed: May 5, 1999
    Date of Patent: June 5, 2001
    Assignee: W. C. Hereaeus GmbH & Co. KG
    Inventors: Günter Herklotz, Lutz Schräpler, Christoph Simons, Jürgen Reuel, Y. C. Cho