Abstract: A device for measuring lithography masks is provided, comprising a reticle carrier for the lithography mask to be measured, a measurement objective for reproducing on a detector a section of said lithography mask held by said reticle carrier, a measurement module for measuring the position of said reticle carrier relative to said measurement objective, and a correction module by means of which said reticle carrier can be moved in order to bring it into a predetermined position relative to said measurement objective, wherein said measurement objective and said measurement module are fastened directly to an instrument carrier in a locally fixed manner.

Abstract: A device for measuring lithography masks is provided, comprising a reticle carrier for the lithography mask to be measured, a measurement objective for reproducing on a detector a section of said lithography mask held by said reticle carrier, a measurement module for measuring the position of said reticle carrier relative to said measurement objective, and a correction module by means of which said reticle carrier can be moved in order to bring it into a predetermined position relative to said measurement objective, wherein said measurement objective and said measurement module are fastened directly to an instrument carrier in a locally fixed manner.

Abstract: A projection exposure apparatus is equipped with an illumination system, a reticle, a projection objective and an image plane. Interstitial spaces between the individual elements of the apparatus are open to the ambient space. A gas purge device which carries a stream of noble gas or nitrogen is arranged in at least one of the interstitial spaces. The gas purge device is of a shape and size so that one or more interstitial spaces are at least to a large extent sealed off from the ambient space surrounding the projection apparatus.

Abstract: A device for holding measurement instruments (2), in particular interferometers, is formed from a plurality of structure elements (4, 5, 6, 7) connected to one another and made from at least one material. The at least one material has a very low coefficient of thermal expansion ?. The structure elements (4) on which the measurement instruments (2) are arranged are secured between at least two structure side parts (5) in such a way that the thermal expansions of the structure side parts (5) and of the connections (3) have no effect in the measurement direction of the measurement instruments (2).

Abstract: A projection exposure apparatus is equipped with an illumination system, a reticle, a projection objective and an image plane. Interstitial spaces between the individual elements of the apparatus are open to the ambient space. A gas purge device which carries a stream of noble gas or nitrogen is arranged in at least one of the interstitial spaces. The gas purge device is of a shape and size so that one or more interstitial spaces are at least to a large extent sealed off from the ambient space surrounding the projection apparatus.

Abstract: An optical system, in particular an exposure lens for semiconductor lithography, with a plurality of optical elements has at least one load-dissipating structure. The load-dissipating structure diverts the forces originating from the optical elements. The optical system also has a measuring structure constructed independently of the at least one load-dissipating structure.

Abstract: A device for holding measurement instruments (2), in particular interferometers, is formed from a plurality of structure elements (4, 5, 6, 7) connected to one another and made from at least one material. The at least one material has a very low coefficient of thermal expansion &agr;. The structure elements (4) on which the measurement instruments (2) are arranged are secured between at least two structure side parts (5) in such a way that the thermal expansions of the structure side parts (5) and of the connections (3) have no effect in the measurement direction of the measurement instruments (2).

Abstract: A lithographic projection apparatus according to one embodiment of the invention includes a projection system having a plurality of optical elements or sensors mounted on a frame. The frame includes support portions made of a material (e.g. a glass ceramic) having a coefficient of thermal expansion of less than or approximately equal to 0.1×10−6 K−1.

Abstract: An optical system, in particular an exposure lens for semiconductor lithography, with a plurality of optical elements has at least one load-dissipating structure. The load-dissipating structure diverts the forces originating from the optical elements. The optical system also has a measuring structure constructed independently of the at least one load-dissipating structure.

Abstract: An optical imaging device, in particular a lens system, has a system diaphragm (1). An aperture of the system diaphragm (1) is adjustable in its opening diameter (D). The axial position of the aperture of the system diaphragm (1) with respect to the optical axis (4) of the system diaphragm (1) is fixed in dependence on the opening diameter (D) of the system diaphragm (1).