Abstract: A freely positionable placement head (1) removes presented flip chips (6) from a wafer (5), the connection side of said chips being directed upward. The placement head has a turning device (9), in which, by the time they are placed onto a substrate (8) to be provided with placed components, the flip chips are turned in such a way that they can be placed with their connection side onto the substrate. This makes it possible to dispense with a complex turning device assigned to the wafer (5).

Abstract: A test plate (1) is equipped with simulations (3) of components in an automatic equipping unit. The simulations comprise defined markings (4). The test plate is provided with local reference marks (5) having high positional precision in the proximity of the markings (4). A printed circuit board camera of the automatic equipping unit serving as topically resolving sensor is successively moved over the markings (4) and reference marks (5). A marking (4) and a reference mark (5) thereby respectively lie in the scan field (6) of the camera. As a result thereof, it is possible to acquire the relative position of the marking (4) relative to the reference mark (5) without thereby having to move the camera, the measuring outlay being reduced as a result thereof.