Abstract: A method for manufacturing a card (102) based on a substrate (101), the method comprising a step of defining the perimeter of the card (102) within the substrate (101), the method also comprising a step of chamfering on a portion of the perimeter of the card (102) so that on completion of the perimeter definition and chamfering steps the physical dimensions of the card (102) are compliant with the parameters A, Ai, B, Bj, C2, C3, and Rm defined by that Micro SD card standard designated V3.00, wherein: i=1, 6 . . . 8; j=1, 4, 10, 11, x, y (the pair [x,y] being equal to [6,9] or to [14,15]); and m=1 . . . 6, 17 . . . 19, the physical dimensions of the card (102) also being compliant with the parameter A9 of the standard when x=6 and y=9.

Abstract: A method for manufacturing a card (102) based on a substrate (101), the method comprising a step of defining the perimeter of the card (102) within the substrate (101), the method also comprising a step of chamfering on a portion of the perimeter of the card (102) so that on completion of the perimeter definition and chamfering steps the physical dimensions of the card (102) are compliant with the parameters A, Ai, B, Bj, C2, C3, and Rm defined by that Micro SD card standard designated V3.00, wherein: i=1, 6 . . . 8; j=1, 4, 10, 11, x, y (the pair [x,y] being equal to [6,9] or to [14,15]); and m=1 . . . 6, 17 . . . 19, the physical dimensions of the card (102) also being compliant with the parameter A9 of the standard when x=6 and y=9.

Abstract: An electronic entity includes a processing circuit (210) capable of receiving a request from a reader and a position sensor (230) capable of measuring an orientation of the electronic entity and of delivering to the processing circuit (210) an item of information indicative of the measured orientation. The processing circuit (210) automatically transmits data to the reader in response to the request provided that the information indicates that the electronic entity is in an orientation included in a predetermined set of orientations.

Abstract: A photomask and method for detecting failures in a mask pattern file using a manufacturing rule are disclosed. The method includes calculating a manufacturing rule based on a design parameter associated with a manufacturing process and measuring a dimension of a non-linear feature in a mask pattern file. A rule violation is identified in the mask pattern file if the measured dimension is less than the calculated manufacturing rule.

Abstract: A photomask and method for reducing electrostatic discharge on the photomask with an ESD protection pattern are disclosed. A photomask includes a substrate and a patterned layer formed on at least a portion of the substrate. The patterned layer includes an electrostatic discharge (ESD) patterned formed between an outer perimeter of an active region and an inner perimeter of a frame region. The ESD pattern reduces ESD effects in the patterned layer.

Abstract: A computer-implemented routine that verifies that an existing chip design can be converted to a PSM or reports localized design conflicts based solely on a knowledge of the specific design constraints applied in the targeted PSM design system and without a prior knowledge of specific layout configurations that will cause PSM design errors.