Abstract: The invention relates to the assembly of devices, produced by replication on a substrate (e.g. LCDs on a glass plate) and separated from each other by a cutting process. Because of the unevenness of the cutting, an assembly of the devices based on the outer boundary of the substrate has inherent inaccuracies. In particular, the invention relates to the precision mounting of a first apparatus part ((1) e.g. an LCD unit) on a second apparatus part ((2) e.g. a light guide) in an apparatus ((3) e.g. a mobile telephone). The invention utilises distinctive marks (6) precisely laid out on the first apparatus part (1) during its processing to control the positioning of decisive components (5) on the apparatus part (1) relative to corresponding features (11) on another apparatus part (2). This is achieved (e.g.

Abstract: The present invention concerns a reinforced conductive layer (7). The layer is applied at a part (3a,b) of an electrical unit, e.g. a mobile telephone, which is to come into contact with another part (3a,b). The layer (7) will protect the covered material against corrosion due to formation of a galvanic element. In a preferred embodiment of the invention the layer (7) is made of the made material as the part (3a,b) which it will come into contact with. Furthermore, spaces (16) may be formed in assembly of a mobile telephone, which spaces (16) are surrounded by conductive material. (FIG.