Patents by Inventor G. Scott Brown

G. Scott Brown has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11015435
    Abstract: A downhole sensor includes a sensor housing with one or more of a pressure sensor or a temperature sensor. A cable segment having a conductor is coupled to the sensor housing. A spacer or retention element is coupled to or secured to at least a portion of the conductor at a location proximate an interface between the cable segment and the sensor housing. Downhole sensor arrays include such sensor housings. Methods relate to forming such sensor arrays.
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: May 25, 2021
    Assignee: Quartzdyne, Inc.
    Inventors: Matthew Palmer, Tyler Sorensen, G. Scott Brown, K. Robert Harker, Trent Heath
  • Patent number: 10767463
    Abstract: Downhole distributed pressure sensor arrays include sensor housings each comprising at least one pressure sensor in a pressure housing. Downhole pressure sensors include a housing, at least one pressure sensor in a pressure housing portion of the housing, and at least one isolation element positioned at an outer wall of the housing.
    Type: Grant
    Filed: November 19, 2018
    Date of Patent: September 8, 2020
    Assignee: Quartzdyne, Inc.
    Inventors: Brian T. Leeflang, G. Scott Brown
  • Publication number: 20190309616
    Abstract: Downhole distributed pressure sensor arrays include sensor housings each comprising at least one pressure sensor in a pressure housing. Downhole pressure sensors include a housing, at least one pressure sensor in a pressure housing portion of the housing, and at least one isolation element positioned at an outer wall of the housing.
    Type: Application
    Filed: November 19, 2018
    Publication date: October 10, 2019
    Inventors: Brian T. Leeflang, G. Scott Brown
  • Patent number: 10330551
    Abstract: Transducer assemblies may include a sensor and a housing including a pass-through portion comprising at least one aperture in a portion of the housing extending along a longitudinal axis of the housing and the sensor. Methods of forming transducer assemblies may include welding a first housing section of the transducer assembly to a second housing portion of the transducer assembly and forming at least one aperture in the first housing section extending along a longitudinal axis of the transducer assembly, along a chamber for holding a sensor, and through the weld.
    Type: Grant
    Filed: April 17, 2018
    Date of Patent: June 25, 2019
    Assignee: Quartzdyne, Inc.
    Inventors: G. Scott Brown, K. Robert Harker, Scott S. Merkley
  • Publication number: 20190186256
    Abstract: A downhole sensor includes a sensor housing with one or more of a pressure sensor or a temperature sensor. A cable segment having a conductor is coupled to the sensor housing. A spacer or retention element is coupled to or secured to at least a portion of the conductor at a location proximate an interface between the cable segment and the sensor housing. Downhole sensor arrays include such sensor housings. Methods relate to forming such sensor arrays.
    Type: Application
    Filed: December 17, 2018
    Publication date: June 20, 2019
    Inventors: Matthew Palmer, Tyler Sorensen, G. Scott Brown, K. Robert Harker, Trent Heath
  • Patent number: 10132156
    Abstract: Downhole distributed pressure sensor arrays include sensor housings each comprising at least one pressure sensor in a pressure housing. Downhole pressure sensors include a housing, at least one pressure sensor in a pressure housing portion of the housing, and at least one isolation element positioned at an outer wall of the housing.
    Type: Grant
    Filed: October 27, 2015
    Date of Patent: November 20, 2018
    Assignee: Quartzdyne, Inc.
    Inventors: Brian T. Leeflang, G. Scott Brown
  • Patent number: 10118257
    Abstract: A method of forming a conditioned isolation element for a sensor assembly comprises subjecting a preformed isolation element structure to at least one thermal annealing process to form a conditioned isolation element structure substantially less susceptible to at least one of hydrogen permeation, hydrogen-based embrittlement, and hydrogen-based stress-cracking. Conditioned isolation elements and sensor assemblies are also described.
    Type: Grant
    Filed: October 21, 2015
    Date of Patent: November 6, 2018
    Assignee: Quartzdyne, Inc.
    Inventors: Nicholas B. Durrant, G. Scott Brown, K. Robert Harker
  • Publication number: 20180238759
    Abstract: Transducer assemblies may include a sensor and a housing including a pass-through portion comprising at least one aperture in a portion of the housing extending along a longitudinal axis of the housing and the sensor. Methods of forming transducer assemblies may include welding a first housing section of the transducer assembly to a second housing portion of the transducer assembly and forming at least one aperture in the first housing section extending along a longitudinal axis of the transducer assembly, along a chamber for holding a sensor, and through the weld.
    Type: Application
    Filed: April 17, 2018
    Publication date: August 23, 2018
    Inventors: G. Scott Brown, K. Robert Harker, Scott S. Merkley
  • Patent number: 10018033
    Abstract: A downhole sensor array includes sensor housings, and each sensor housing contains one or more of a pressure sensor and a temperature sensor. Cable segments connect the sensor housings. A weld joint bonds a sensor housing to a jacket of a cable segment, and a conductor of the cable segment and the jacket of the cable segment may be separated by a void proximate the weld joint. Methods relate to forming such sensor arrays.
    Type: Grant
    Filed: October 27, 2015
    Date of Patent: July 10, 2018
    Assignee: Quartzdyne, Inc.
    Inventors: Brian T. Leeflang, G. Scott Brown
  • Patent number: 9964459
    Abstract: Transducer assemblies may include a sensor and a housing including a pass-through portion comprising at least one aperture in a portion of the housing extending along a longitudinal axis of the housing and the sensor. Methods of forming transducer assemblies may include welding a first housing section of the transducer assembly to a second housing portion of the transducer assembly and forming at least one aperture in the first housing section extending along a longitudinal axis of the transducer assembly, along a chamber for holding a sensor, and through the weld.
    Type: Grant
    Filed: October 27, 2015
    Date of Patent: May 8, 2018
    Assignee: Quartzdyne, Inc.
    Inventors: G. Scott Brown, K. Robert Harker, Scott S. Merkley
  • Publication number: 20160138992
    Abstract: A method of forming a conditioned isolation element for a sensor assembly comprises subjecting a preformed isolation element structure to at least one thermal annealing process to form a conditioned isolation element structure substantially less susceptible to at least one of hydrogen permeation, hydrogen-based embrittlement, and hydrogen-based stress-cracking. Conditioned isolation elements and sensor assemblies are also described.
    Type: Application
    Filed: October 21, 2015
    Publication date: May 19, 2016
    Inventors: Nicholas B. Durrant, G. Scott Brown, K. Robert Harker
  • Publication number: 20160123133
    Abstract: Downhole distributed pressure sensor arrays include sensor housings each comprising at least one pressure sensor in a pressure housing. Downhole pressure sensors include a housing, at least one pressure sensor in a pressure housing portion of the housing, and at least one isolation element positioned at an outer wall of the housing.
    Type: Application
    Filed: October 27, 2015
    Publication date: May 5, 2016
    Inventors: Brian T. Leeflang, G. Scott Brown
  • Publication number: 20160123135
    Abstract: A downhole sensor array includes sensor housings, and each sensor housing contains one or more of a pressure sensor and a temperature sensor. Cable segments connect the sensor housings. A weld joint bonds a sensor housing to a jacket of a cable segment, and a conductor of the cable segment and the jacket of the cable segment may be separated by a void proximate the weld joint. Methods relate to forming such sensor arrays.
    Type: Application
    Filed: October 27, 2015
    Publication date: May 5, 2016
    Inventors: Brian T. Leeflang, G. Scott Brown
  • Publication number: 20160123830
    Abstract: Transducer assemblies may include a sensor and a housing including a pass-through portion comprising at least one aperture in a portion of the housing extending along a longitudinal axis of the housing and the sensor. Methods of forming transducer assemblies may include welding a first housing section of the transducer assembly to a second housing portion of the transducer assembly and forming at least one aperture in the first housing section extending along a longitudinal axis of the transducer assembly, along a chamber for holding a sensor, and through the weld.
    Type: Application
    Filed: October 27, 2015
    Publication date: May 5, 2016
    Inventors: G. Scott Brown, K. Robert Harker, Scott S. Merkley