Patents by Inventor Götz Springer

Götz Springer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for characterizing and simulating a chemical mechanical polishing process
    Patent number: 6965809
    Abstract: A method for characterizing and simulating a CMP process, in which a substrate to be polished, in particular a semiconductor wafer, is pressed onto a polishing cloth and is rotated relative to the latter for a defined polishing time. The method includes defining a set of process parameters, in particular a compressive force and a relative rotational speed between a substrate and polishing cloth; preparing and characterizing a test substrate having test patterns with different structure densities using the defined process parameters; determining a set of model parameters for simulating the CMP process from results of the characterization of the test substrate; determining layout parameters of the substrate which is to be polished; defining a profile of demands for a CMP process result for the substrate to be polished; and simulating the CMP process in order to determine the polishing time required to satisfy the profile of demands.
    Type: Grant
    Filed: June 27, 2003
    Date of Patent: November 15, 2005
    Assignee: Infineon Technologies AG
    Inventors: Wolfgang Dickenscheid, Frank Meyer, Stephanie Delage, Götz Springer
  • Method for characterizing and simulating a chemical mechanical polishing process
    Publication number: 20040034516
    Abstract: A method for characterizing and simulating a CMP process, in which a substrate to be polished, in particular a semiconductor wafer, is pressed onto a polishing cloth and is rotated relative to the latter for a defined polishing time. The method includes defining a set of process parameters, in particular a compressive force and a relative rotational speed between a substrate and polishing cloth; preparing and characterizing a test substrate having test patterns with different structure densities using the defined process parameters; determining a set of model parameters for simulating the CMP process from results of the characterization of the test substrate; determining layout parameters of the substrate which is to be polished; defining a profile of demands for a CMP process result for the substrate to be polished; and simulating the CMP process in order to determine the polishing time required to satisfy the profile of demands.
    Type: Application
    Filed: June 27, 2003
    Publication date: February 19, 2004
    Inventors: Wolfgang Dickenscheid, Frank Meyer, Stephanie Delage, Gotz Springer
  • Apparatus and method for heating a liquid or viscous polishing agent, and device for polishing wafers
    Patent number: 6257955
    Abstract: An apparatus for polishing wafers includes a polishing table with a heating device. A conduit connects a tank holding a liquid polishing agent to a distributor for feeding the liquid polishing agent to the polishing table. A heat exchanger is disposed along the conduit between the tank and the distributor for heating the liquid polishing agent. The heat exchanger is independent of said heating device. A method for heating a polishing agent is also provided.
    Type: Grant
    Filed: February 29, 2000
    Date of Patent: July 10, 2001
    Assignee: Infineon Technologies AG
    Inventors: Götz Springer, Wolfgang Diewald, Andre Richter