Patents by Inventor G. Venkata Krishnan

G. Venkata Krishnan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7724526
    Abstract: An electronic module includes a printed circuit board with a heat producing electrical component assembled in an insulating housing. The component is adjacent a thermally conducting heat sink with a thermally conductive material disposed therebetween. Integral with the heat sink is a thermally conductive runner, partially encased in the housing wall, connecting the heat sink to a thermally conductive port. The port is coupled to a base structure when the housing is attached to the base, forming a heat conduction path from the component to the base. This conductive path may also provide an electrical ground path from the printed circuit board to the base.
    Type: Grant
    Filed: October 10, 2008
    Date of Patent: May 25, 2010
    Assignee: Delphi Technologies, Inc.
    Inventors: Lee R. Hinze, G. Venkata Krishnan, Scott E. Wilson
  • Publication number: 20100091460
    Abstract: An electronic module includes a printed circuit board with a heat producing electrical component assembled in an insulating housing. The component is adjacent a thermally conducting heat sink with a thermally conductive material disposed therebetween. Integral with the heat sink is a thermally conductive runner, partially encased in the housing wall, connecting the heat sink to a thermally conductive port. The port is coupled to a base structure when the housing is attached to the base, forming a heat conduction path from the component to the base. This conductive path may also provide an electrical ground path from the printed circuit board to the base.
    Type: Application
    Filed: October 10, 2008
    Publication date: April 15, 2010
    Inventors: Lee R. Hinze, G. Venkata Krishnan, Scott E. Wilson