Patents by Inventor Gaètan Mathiew
Gaètan Mathiew has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 6359236Abstract: A semiconductor chip mounting component includes a support structure having top and bottom surfaces and an edge, a plurality of electrically conductive leads, not attached to a chip, each lead having a first end securement section secured to the support structure and having a connection section integral with the first end securement section projecting beyond the edge of the support structure, and a flexible polymeric reinforcement in contact with and extending along the connection section of each lead, each polymeric reinforcement being separate from the polymeric reinforcements in contact with the other leads, each polymeric reinforcement extending beyond the edge of the support structure wherein each connection section is flexible and may be individually displaced without displacement of connection sections of adjacent ones of the leads.Type: GrantFiled: August 13, 1996Date of Patent: March 19, 2002Assignee: Tessera, Inc.Inventors: Thomas H. DiStefano, Gary W. Grube, Igor Y. Khandros, Gaétan Mathiew
-
Patent number: 6272744Abstract: A connection component for electrically connecting a semiconductor chip to a support substrate incorporates a preferably dielectric supporting structure defining gaps. Leads extend across these gaps so that the leads are supported on both sides of the gap. The leads therefore can be positioned approximately in registration to contacts on the chip by aligning the connection component with the chip. Each lead is arranged so that one end can be displaced relative to the supporting structure when a downward force is applied to the lead. This allows the leads to be connected to the contacts on the chip by engaging each lead with a tool and forcing the lead downwardly against the contact. Preferably, each lead incorporates a frangible section adjacent one side of the gap and the frangible section is broken when the lead is engaged with the contact. Final alignment of the leads with the contacts on the chip is provided by the bonding tool, which has features adapted to control the position of the lead.Type: GrantFiled: May 24, 1999Date of Patent: August 14, 2001Assignee: Tessera, Inc.Inventors: Thomas H. DiStefano, Gary W. Grube, Igor Y. Khandros, Gaètan Mathiew
-
Patent number: 5977618Abstract: A connection component for electrically connecting a semiconductor chip to a support substrate incorporates a preferably dielectric supporting structure defining gaps. Leads extend across these gaps so that the leads are supported on both sides of the gap. The leads therefore can be positioned approximately in registration to contacts on the chip by aligning the connection component with the chip. Each lead is arranged so that one end can be displaced relative to the supporting structure when a downward force is applied to the lead. This allows the leads to be connected to the contacts on the chip by engaging each lead with a tool and forcing the lead downwardly against the contact. Preferably, each lead incorporates a frangible section adjacent one side of the gap and the frangible section is broken when the lead is engaged with the contact. Final alignment of the leads with the contacts on the chip is provided by the bonding tool, which has features adapted to control the position of the lead.Type: GrantFiled: April 7, 1998Date of Patent: November 2, 1999Assignee: Tessera, Inc.Inventors: Thomas H. DiStefano, Gary W. Grube, Igor Y. Khandros, Gaetan Mathiew
-
Patent number: 5787581Abstract: A connection component for electrically connecting a semiconductor chip to a support substrate incorporates a preferably dielectric supporting structure defining gaps. Leads extend across these gaps so that the leads are supported on both sides of the gap. The leads therefore can be positioned approximately in registration to contacts on the chip by aligning the connection component with the chip. Each lead is arranged so that one end can be displaced relative to the supporting structure when a downward force is applied to the lead. This allows the leads to be connected to the contacts on the chip by engaging each lead with a tool and forcing the lead downwardly against the contact. Preferably, each lead incorporates a frangible section adjacent one side of the gap and the frangible section is broken when the lead is engaged with the contact. Final alignment of the leads with the contacts on the chip is provided by the bonding tool, which has features adapted to control the position of the lead.Type: GrantFiled: August 17, 1995Date of Patent: August 4, 1998Assignee: Tessera, Inc.Inventors: Thomas H. DiStefano, Gary W. Grube, Igor Y. Khandros, Gaetan Mathiew
-
Patent number: 5536909Abstract: A connection component for electrically connecting a semiconductor chip to a support substrate incorporates a preferably dielectric supporting structure defining gaps. Leads extend across these gaps so that the leads are supported on both sides of the gap. The leads therefore can be positioned approximately in registration to contacts on the chip by aligning the connection component with the chip. Each lead is arranged so that one end can be displaced relative to the supporting structure when a downward force is applied to the lead. This allows the leads to be connected to the contacts on the chip by engaging each lead with a tool and forcing the lead downwardly against the contact. Preferably, each lead incorporates a frangible section adjacent one side of the gap and the frangible section is broken when the lead is engaged with the contact. Final alignment of the leads with the contacts on the chip is provided by the bonding tool, which has features adapted to control the position of the lead.Type: GrantFiled: October 13, 1994Date of Patent: July 16, 1996Assignee: Tessera, Inc.Inventors: Thomas H. DiStefano, Gary W. Grube, Igor Y. Khandros, Gaetan Mathiew
-
Patent number: 5489749Abstract: A connection component for electrically connecting a semiconductor chip to a support substrate incorporates a preferably dielectric supporting structure defining gaps. Leads extend across these gaps so that the leads are supported on both sides of the gap. The leads therefore can be positioned approximately in registration to contacts on the chip by aligning the connection component with the chip. Each lead is arranged so that one end can be displaced relative to the supporting structure when a downward force is applied to the lead. This allows the leads to be connected to the contacts on the chip by engaging each lead with a tool and forcing the lead downwardly against the contact. Preferably, each lead incorporates a frangible section adjacent one side of the gap and the frangible section is broken when the lead is engaged with the contact. Final alignment of the leads with the contacts on the chip is provided by the bonding tool, which has features adapted to control the position of the lead.Type: GrantFiled: June 29, 1994Date of Patent: February 6, 1996Assignee: Tessera, Inc.Inventors: Thomas H. DiStefano, Gary W. Grube, Igor Y. Khandros, Gaetan Mathiew
-
Patent number: 5390844Abstract: A bonding tool for bonding inner leads to semiconductor chips is arranged to capture and align elongated lead sections extending in any one of plural directions, and preferably, in any one of two mutually orthogonal directions. Thus, the tool can be applied to align and bond all of the leads to a chip without turning the tool or the chip even where the leads extend in multiple directions.Type: GrantFiled: July 23, 1993Date of Patent: February 21, 1995Assignee: Tessera, Inc.Inventors: Thomas H. Distefano, Igor Y. Khandros, Gaetan Mathiew, Jason Sweis, John Grange, Gary W. Grube