Abstract: An embodiment composition for solid electrolyte membranes of all-solid-state batteries includes a sulfide-based solid electrolyte and a cross-linking agent including two or more acrylate functionalities. An embodiment method of manufacturing a solid electrolyte membrane for an all-solid-state battery includes forming a composition including a sulfide-based solid electrolyte and a cross-linking agent including two or more acrylate functionalities and cross-linking the composition.

Abstract: An anodeless all-solid-state battery includes an anode current collector, a composite structure layer positioned on the anode current collector, a solid electrolyte positioned on the composite structure layer, and a cathode positioned on the solid electrolyte, in which the composite structure layer includes a carbon layer including a carbon material, and a metal deposition layer positioned on the carbon layer and including lithiophilic metal particles.

Abstract: An apparatus and a method for non-destructive inspection of quality of an electrostatic chuck are disclosed. The apparatus includes a measurement unit for measuring a first capacitance of a dielectric layer of the electrostatic chuck and for measuring a second capacitance of an electrode installed in the dielectric layer; and a control unit configured to evaluate quality of the electrode, based on the first capacitance and the second capacitance.

Abstract: The present disclosure relates to a robotic cleaner. The robotic cleaner may be configured such that an imaginary plane passing mop contact portions having a small area passes through the center of gravity of the robotic cleaner, thereby travelling while the mops effectively scrub a floor surface.

Abstract: A semiconductor device package includes a resin unit having a first through hole and a second through hole, a conductive body disposed on the resin unit and having a cavity that is concave in a first direction from a top surface of the conductive body toward a bottom surface thereof, and a light-emitting device disposed in the cavity, wherein the conductive body includes a first protrusion and a second protrusion, which protrude in the first direction from the bottom surface of the conductive body, and the first protrusion is disposed inside the first through hole, the second protrusion is disposed inside the second through hole, and a top surface of the resin unit is in contact with the bottom surface of the conductive body.

Abstract: A lightweight sensor member may include a fastening hole formed through a center thereof to be fastened to a camshaft, and a plurality of detecting protrusions formed on an external peripheral surface thereof, each having a certain angular shape to the fastening hole.

Abstract: According to an embodiment, a light-emitting device is disclosed. The disclosed light-emitting device comprises: a substrate having a body and first and second lead electrodes on the body; a light-emitting chip arranged on the second lead electrode and electrically connected to the first and second lead electrodes; a phosphor film arranged on the light-emitting chip; a reflective member arranged on the outer peripheries of the light-emitting chip and the phosphor film, respectively; and an optical lens, which is arranged on the phosphor film and on the reflective member, and which has a lens portion that has an aspherical shape.

Abstract: A semiconductor device package includes a resin unit having a first through hole and a second through hole, a conductive body disposed on the resin unit and having a cavity that is concave in a first direction from a top surface of the conductive body toward a bottom surface thereof, and a light-emitting device disposed in the cavity, wherein the conductive body includes a first protrusion and a second protrusion, which protrude in the first direction from the bottom surface of the conductive body, and the first protrusion is disposed inside the first through hole, the second protrusion is disposed inside the second through hole, and a top surface of the resin unit is in contact with the bottom surface of the conductive body.

Abstract: According to an embodiment, a light-emitting device is disclosed. The disclosed light-emitting device comprises: a substrate having a body and first and second lead electrodes on the body; a light-emitting chip arranged on the second lead electrode and electrically connected to the first and second lead electrodes; a phosphor film arranged on the light-emitting chip; a reflective member arranged on the outer peripheries of the light-emitting chip and the phosphor film, respectively; and an optical lens, which is arranged on the phosphor film and on the reflective member, and which has a lens portion that has an aspherical shape.

Abstract: A semiconductor device package and a lighting device including a semiconductor device package are provided. The semiconductor device package may include a substrate, a first electrode module provided on the substrate, a light emitting device provided in a first region of the first electrode module, a second electrode module electrically disconnected from the first electrode module and provided on the substrate, and an insulating reflection layer provided on a circumference of the light emitting device between the first electrode module and the second electrode module and having a polygonal shape.

Abstract: A lightweight sensor member may include a fastening hole formed through a center thereof to be fastened to a camshaft, and a plurality of detecting protrusions formed on an external peripheral surface thereof, each having a certain angular shape to the fastening hole.

Abstract: A semiconductor device package and a lighting device including a semiconductor device package are provided. The semiconductor device package may include a substrate, a first electrode module provided on the substrate, a light emitting device provided in a first region of the first electrode module, a second electrode module electrically disconnected from the first electrode module and provided on the substrate, and an insulating reflection layer provided on a circumference of the light emitting device between the first electrode module and the second electrode module and having a polygonal shape.

Abstract: One embodiment provides a light emitting device comprising: a substrate; a first electrode arranged on the substrate; a light emitting structure arranged on the first electrode and including a first semiconductor layer, a second semiconductor layer, and an active layer between the first and second semiconductor layers; and a second electrode arranged on the second semiconductor layer, wherein the second electrode includes: a pad electrode; and a branch electrode extending from the pad electrode and having a hexagonal structure for enabling an upper surface of the second semiconductor layer to be exposed in a hexagonal shape.