Abstract: An electronic device including a semiconductor memory. The semiconductor memory may include a variable resistance element. The variable resistance element may include a first magnetic layer formed over a first auxiliary layer, a tunnel barrier layer formed over the first magnetic layer, a second magnetic layer formed over the tunnel barrier layer, a second auxiliary layer formed over the second magnetic layer, and a hard mask formed over the second auxiliary layer. Side surfaces of the first magnetic layer may be substantially aligned with side surfaces of the first auxiliary layer, and the side surfaces of the first magnetic layer may deviate from side surfaces of the hard mask.

Abstract: A method for fabricating an electronic device comprising a semiconductor memory is described. The method comprises forming material layers over a substrate; forming a hard mask pattern over the material layers, the hard mask pattern including an amorphous carbon layer; forming a capping protective layer including a portion on sidewalls of the hard mask pattern; and etching the material layers using the hard mask pattern as an etch barrier.

Abstract: A method for fabricating an electronic device comprising a semiconductor memory is described. The method comprises forming material layers over a substrate; forming a hard mask pattern over the material layers, the hard mask pattern including an amorphous carbon layer; forming a capping protective layer including a portion on sidewalls of the hard mask pattern; and etching the material layers using the hard mask pattern as an etch barrier.

Abstract: An electronic device is provided to include a semiconductor memory which includes one or more variable resistance elements, wherein each variable resistance element may include a Magnetic Tunnel Junction (MTJ) structure including a free layer having a changeable magnetization direction, a pinned layer having a fixed magnetization direction and a tunnel barrier layer interposed between the free layer and the pinned layer; and a sidewall spacer disposed on a sidewall of the variable resistance element and including an amorphous silicon.

Abstract: A method for fabricating an electronic device including a semiconductor memory includes: forming a variable resistance element over a substrate, the variable resistance element including a metal-containing layer and an MTJ (Magnetic Tunnel Junction) structure which is located over the metal-containing layer and includes a free layer having a variable magnetization direction, a pinned layer having a fixed magnetization direction and a tunnel barrier layer interposed between the free layer and the pinned layer; forming an initial spacer containing a metal over the variable resistance element; performing an oxidation process to transform the initial spacer into a middle spacer including an insulating metal oxide; and performing a treatment using a gas or plasma including nitrogen and hydrogen to transform the middle spacer produced by the oxidation process into a final spacer including an insulating metal nitride or an insulating metal oxynitride.

Abstract: An electronic device includes a semiconductor memory, wherein the semiconductor memory includes a variable resistance element formed over a substrate, and a multi-layer passivation layer positioned over sidewalls of the variable resistance element and having two or more insulating layers formed over the sidewalls of the variable resistance element.

Abstract: An electronic device including a semiconductor memory. The semiconductor memory may include a variable resistance element. The variable resistance element may include a first magnetic layer formed over a first auxiliary layer, a tunnel barrier layer formed over the first magnetic layer, a second magnetic layer formed over the tunnel barrier layer, a second auxiliary layer formed over the second magnetic layer, and a hard mask formed over the second auxiliary layer. Side surfaces of the first magnetic layer may be substantially aligned with side surfaces of the first auxiliary layer, and the side surfaces of the first magnetic layer may deviate from side surfaces of the hard mask.

Abstract: An electronic device may include a semiconductor memory, and the semiconductor memory may include may include a predetermined structure; a hard mask pattern disposed over the predetermined structure and including an amorphous carbon layer; and a capping protective layer disposed on sidewalls of the hard mask pattern.

Abstract: An electronic device including a semiconductor memory. The semiconductor memory may include a variable resistance element. The variable resistance element may include a first magnetic layer formed over a first auxiliary layer, a tunnel barrier layer formed over the first magnetic layer, a second magnetic layer formed over the tunnel barrier layer, a second auxiliary layer formed over the second magnetic layer, and a hard mask formed over the second auxiliary layer. Side surfaces of the first magnetic layer may be substantially aligned with side surfaces of the first auxiliary layer, and the side surfaces of the first magnetic layer may deviate from side surfaces of the hard mask.

Abstract: A method for fabricating an electronic device including a semiconductor memory includes: forming an etching target layer over a substrate; forming an initial hard mask pattern including a carbon-containing material over the etching target layer; forming a hard mask pattern by doping an impurity which increases a hardness of the carbon-containing material into a surface portion of the initial hard mask pattern; and etching the etching target layer by using the hard mask pattern as an etching barrier.

Abstract: An electronic device including a semiconductor memory is provided to include a predetermined structure; and a hard mask pattern disposed over the predetermined structure and including a sputtering carbon layer as a permanent part of the semiconductor memory.

Abstract: An electronic device is provided to include a semiconductor memory which includes one or more variable resistance elements, wherein each variable resistance element may include a Magnetic Tunnel Junction (MTJ) structure including a free layer having a changeable magnetization direction, a pinned layer having a fixed magnetization direction and a tunnel barrier layer interposed between the free layer and the pinned layer; and a sidewall spacer disposed on a sidewall of the variable resistance element and including an amorphous silicon.

Abstract: An electronic device including a semiconductor memory. The semiconductor memory may include a variable resistance element. The variable resistance element may include a first magnetic layer formed over a first auxiliary layer, a tunnel barrier layer formed over the first magnetic layer, a second magnetic layer formed over the tunnel barrier layer, a second auxiliary layer formed over the second magnetic layer, and a hard mask formed over the second auxiliary layer. Side surfaces of the first magnetic layer may be substantially aligned with side surfaces of the first auxiliary layer, and the side surfaces of the first magnetic layer may deviate from side surfaces of the hard mask.

Abstract: A method for fabricating an electronic device including a semiconductor memory includes: forming an etching target layer over a substrate; forming an initial hard mask pattern including a carbon-containing material over the etching target layer; forming a hard mask pattern by doping an impurity which increases a hardness of the carbon-containing material into a surface portion of the initial hard mask pattern; and etching the etching target layer by using the hard mask pattern as an etching barrier.

Abstract: A method for fabricating an electronic device including a semiconductor memory includes: forming a variable resistance element over a substrate, the variable resistance element including a metal-containing layer and an MTJ (Magnetic Tunnel Junction) structure which is located over the metal-containing layer and includes a free layer having a variable magnetization direction, a pinned layer having a fixed magnetization direction and a tunnel barrier layer interposed between the free layer and the pinned layer; forming an initial spacer containing a metal over the variable resistance element; performing an oxidation process to transform the initial spacer into a middle spacer including an insulating metal oxide; and performing a treatment using a gas or plasma including nitrogen and hydrogen to transform the middle spacer produced by the oxidation process into a final spacer including an insulating metal nitride or an insulating metal oxynitride.

Abstract: An electronic device includes a semiconductor memory, wherein the semiconductor memory includes a variable resistance element formed over a substrate, and a multi-layer passivation layer positioned over sidewalls of the variable resistance element and having two or more insulating layers formed over the sidewalls of the variable resistance element.

Abstract: An electronic device includes a semiconductor memory that includes: a variable resistance element formed over a substrate; and a carbon-containing aluminum nitride layer formed on sidewalls and in an upper portion of the variable resistance element.

Abstract: An electronic device includes a semiconductor memory, wherein the semiconductor memory includes a variable resistance element formed over a substrate, and a multi-layer passivation layer positioned over sidewalls of the variable resistance element and having two or more insulating layers formed over the sidewalls of the variable resistance element.

Abstract: An electronic device comprising a semiconductor memory unit includes: variable resistance patterns formed over a substrate; a protective layer formed over the substrate including the variable resistance patterns and including a leakage current blocking layer that is spaced apart from the variable resistance patterns; and contact plugs formed adjacent to the variable resistance patterns over the substrate and penetrating through the protective layer to be coupled with the substrate.

Abstract: A semiconductor device includes a magnetic tunnel junction (MTJ) element, an electrode layer pattern formed over the MTJ element, a protective layer for protecting the MTJ element and the electrode layer pattern, wherein the protective layer is arranged to expose a first area of the electrode layer pattern, a first insulation layer formed over the protective layer and arranged to form a first hole exposing the first area of the electrode layer pattern, a second insulation layer formed over the first insulation layer and arranged to form a second hole over the first hole, wherein the second hole has a larger width than the first hole, and an overhang pattern protruding from a sidewall of the first hole and suitable for preventing the protective layer on a sidewall of the MTJ element.