Abstract: Provided is a camera module using a PCB with a step portion. The camera module includes a PCB, a housing, and a lens barrel. The PCB includes a substrate main body, a plurality of pads, and a step portion. The substrate main body is formed of a stacked structure with the shape of a rectangular plate. The pads is formed on both sides of the top of the substrate main body and is electrically connected through wires to an image sensor mounted on a central portion of the top of the substrate main body. The step portion is formed at the peripheral edges of the pads. The housing has a bottom peripheral portion that is closely attached to the step portion of the PCB. The lens barrel is installed vertically in an upper region of the housing. Accordingly, it is possible to enhance the quality of image taken by the image sensor. In addition, the contact area between the housing and the PCB is increased to make it possible to enhance the assembly reliability of the camera module.