Patents by Inventor Gab Soo Choi

Gab Soo Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and die bonding structure thereof
    Patent number: 9070561
    Abstract: Provided are a semiconductor device and a bonding structure thereof, in which an inter-metal compound is not formed with a semiconductor die or a lead frame, thereby improving electrical and mechanical properties and wettability and suppressing conglomeration of a die bonding material. The semiconductor device includes a semiconductor die, a barrier layer formed on a surface of the semiconductor die, a first metal layer formed on the barrier layer, a central metal layer formed on the first metal layer, and a second metal layer formed on the central metal layer. Here, the first and second metal layers have a first melting temperature, and the central metal layer has a second melting temperature lower than the first melting temperature.
    Type: Grant
    Filed: October 16, 2014
    Date of Patent: June 30, 2015
    Assignee: KEC Corporation
    Inventors: Kyu Hyo Hwang, Jong Hong Lee, Gab Soo Choi, Cha Soo Jeon, Jin Sang Park, Sang Bo Bae, Yong Min Park, Sung Jin An
  • SEMICONDUCTOR DEVICE AND DIE BONDING STRUCTURE THEREOF
    Publication number: 20150123253
    Abstract: Provided are a semiconductor device and a bonding structure thereof, in which an inter-metal compound is not formed with a semiconductor die or a lead frame, thereby improving electrical and mechanical properties and wettability and suppressing conglomeration of a die bonding material. The semiconductor device includes a semiconductor die, a barrier layer formed on a surface of the semiconductor die, a first metal layer formed on the barrier layer, a central metal layer formed on the first metal layer, and a second metal layer formed on the central metal layer. Here, the first and second metal layers have a first melting temperature, and the central metal layer has a second melting temperature lower than the first melting temperature.
    Type: Application
    Filed: October 16, 2014
    Publication date: May 7, 2015
    Inventors: Kyu Hyo Hwang, Jong Hong Lee, Gab Soo Choi, Cha Soo Jeon, Jin Sang Park, Sang Bo Bae, Yong Min Park, Sung Jin An