Abstract: A semiconductor system for peeling semiconductor chips from tape, comprising: providing an outer housing having an aperture on a top thereof; providing a magnet with a needle base extension; providing needles magnetically held to the magnet; applying a vacuum through the aperture to hold an adhesive material to the outer housing; and extending the needles through the aperture in the outer housing.

Abstract: The present invention provides a system for handling semiconductor dies, comprising providing a semiconductor die adhered to a tacky tape, cooling the semiconductor die and the tacky tape to reduce the adhesion between the semiconductor die and the tacky tape, separating the semiconductor die from the tacky tape, and moving the semiconductor die.

Abstract: A semiconductor system for peeling semiconductor chips from tape, comprising: providing an outer housing having an aperture on a top thereof; providing a magnet with a needle base extension; providing needles magnetically held to the magnet; applying a vacuum through the aperture to hold an adhesive material to the outer housing; and extending the needles through the aperture in the outer housing.

Abstract: A system for peeling semiconductor chips from tape is provided with a nose on a housing. The nose has transverse dimensions smaller than the transverse dimensions of a target chip. Apertures are provided through the nose from the housing. Vacuum ports are provided in the housing adjacent the nose. A vacuum source controllably connects to the apertures and the vacuum ports. The nose is positioned adjacent a tape attached on the opposite side thereof to the target chip. Vacuum is applied to attract the tape against the nose and the adjacent portions of the housing to peel the tape from the peripheral edges of the target chip while supporting the tape in the center of the target chip.

Abstract: A system for peeling semiconductor chips from tape is provided with a nose on a housing. The nose has transverse dimensions smaller than the transverse dimensions of a target chip. Apertures are provided through the nose from the housing. Vacuum ports are provided in the housing adjacent the nose. A vacuum source controllably connects to the apertures and the vacuum ports. The nose is positioned adjacent a tape attached on the opposite side thereof to the target chip. Vacuum is applied to attract the tape against the nose and the adjacent portions of the housing to peel the tape from the peripheral edges of the target chip while supporting the tape in the center of the target chip.