Abstract: A disclosed semiconductor device includes (1) a silicon stack comprising a front-side Back-End-of-Line (BEOL) stack and a back side BEOL stack, the front-side BEOL stack comprising a plurality of signal routes and the back-side BEOL stack comprising a plurality of power delivery routes, and (2) a plurality of auxiliary power paths formed within the front-side BEOL stack and electrically coupled to the plurality of power delivery routes of the back-side BEOL stack via a plurality of programmable switches, the plurality of power delivery routes, the plurality of programmable switches, and the plurality of auxiliary power paths forming a programmable power delivery network (PDN). Various other apparatuses, systems, and methods of operation are also disclosed.

Abstract: An accelerator device includes a first processing unit to access a structure of a graph dataset, and a second processing unit coupled with the first processing unit to perform computations based on data values in the graph dataset.

Abstract: A semiconductor package includes a package substrate having a first surface and an opposing second surface, and further includes an integrated circuit (IC) die disposed at the second surface and having a third surface facing the second surface and an opposing fourth surface. The IC die has a first region comprising one or more metal layers and circuit components for one or more functions of the IC die and a second region offset from the first region in a direction parallel with the third and fourth surfaces. The semiconductor package further includes a voltage regulator disposed at the fourth surface in the second region and having an input configured to receive a supply voltage and an output configured to provide a regulated voltage, and also includes a conductive path coupling the output of the voltage regulator to a voltage input of circuitry of the IC die.

Abstract: The disclosed device a controller that sets an iteration counter for a loop based on an iteration value read from a loop iteration instruction for the loop. The controller also updates the iteration counter based on a number of times a loop heading instruction for the loop is decoded. When the iteration counter reaches an end value, the controller selects a not taken identifier for the loop to be fetched, to avoid a branch misprediction. Various other methods, systems, and computer-readable media are also disclosed.

Abstract: An accelerator device includes a first processing unit to access a structure of a graph dataset, and a second processing unit coupled with the first processing unit to perform computations based on data values in the graph dataset.

Abstract: A semiconductor package includes a package substrate having a first surface and an opposing second surface, and further includes an integrated circuit (IC) die disposed at the second surface and having a third surface facing the second surface and an opposing fourth surface. The IC die has a first region comprising one or more metal layers and circuit components for one or more functions of the IC die and a second region offset from the first region in a direction parallel with the third and fourth surfaces. The semiconductor package further includes a voltage regulator disposed at the fourth surface in the second region and having an input configured to receive a supply voltage and an output configured to provide a regulated voltage, and also includes a conductive path coupling the output of the voltage regulator to a voltage input of circuitry of the IC die.

Abstract: A disclosed computing device includes at least one prefetcher and a processing device communicatively coupled to the prefetcher. The processing device is configured to detect a throttling instruction that indicates a start of a throttling region. The computing device is further configured to prevent the prefetcher from being trained on one or more memory instructions included in the throttling region in response to the throttling instruction. Various other apparatuses, systems, and methods are also disclosed.

Abstract: An electronic device includes processing circuitry that executes a lookup table (LUT) vector instruction. Executing the lookup table vector instruction causes the processing circuitry to acquire a set of reference values by using each input value from an input vector as an index to acquire a reference value from a reference vector. The processing circuitry then provides the set of reference values for one or more subsequent operations. The processing circuitry can also use the set of reference values for controlling vector elements from among a set of vector elements for which a vector operation is performed.

Abstract: A processor includes one or more processor cores configured to perform accumulate top (ACCT) and accumulate bottom (ACCB) instructions. To perform such instructions, at least one processor core of the processor includes an ACCT data path that adds a first portion of a block of data to a first lane of a set of lanes of a top accumulator and adds a carry-out bit to a second lane of the set of lanes of the top accumulator. Further, the at least one processor core includes an ACCB data path that adds a second portion of the block of data to a first lane of a set of lanes of a bottom accumulator and adds a carry-out bit to a second lane of the set of lanes of the bottom accumulator.

Abstract: A method for die pair partitioning can include providing a first circuit die having a first metal stack. The method can additionally include positioning a second circuit die having a second metal stack in a manner that places a temperature sensor in a transistor layer of the second circuit die in planar proximity to at least one hot spot located in an additional transistor layer of the first circuit die. The method can also include connecting the first metal stack of the first circuit die to the second metal stack of the second circuit die. Various other methods, systems, and computer-readable media are also disclosed.

Abstract: A substrate includes a location for coupling one or more chiplets to the substrate. The location has dimensions that bound dimensions of chiplets capable of being coupled to the substrate in the location. Additionally, the location includes an interface region having connections for one or more die-to-die interfaces of the one or more chiplets and a power region that includes a power interface having connections for the one or more chiplets.

Abstract: A processing device for encoding floating point numbers comprising memory configured to store data comprising the floating point numbers and circuitry. The circuitry is configured to, for a set of the floating point numbers, identify which of the floating point numbers represent a zero value and which of the floating point numbers represent a non-zero value, convert the floating point numbers which represent a non-zero value into a block floating point format value and generate an encoded sparse block floating point format value. The circuitry is also configured to, decode floating point numbers. For an encoded block floating point format value, the circuitry converts the encoded block floating point format value to a set of non-zero floating point numbers based on a sparsity mask previously generated to encode the encoded block floating point format value and generates a non-sparse set of floating point values.

Abstract: A method for performing prefetching operations is disclosed. The method includes storing a recorded access pattern indicating a set of accesses for a region; in response to an access within the region, fetching the recorded access pattern; and performing prefetching based on the access pattern.

Abstract: A processing unit includes a plurality of adders and a plurality of carry bit generation circuits. The plurality of adders add first and second X bit binary portion values of a first Y bit binary value and a second Y bit binary value. Y is a multiple of X. The plurality of adders further generate first carry bits. The plurality of carry bit generation circuits is coupled to the plurality of adders, respectively, and receive the first carry bits. The plurality of carry bit generation circuits generate second carry bits based on the first carry bits. The plurality of adders use the second carry bits to add the first and second X bit binary portions of the first and second Y bit binary values, respectively.

Abstract: A disclosed computing device includes at least one prefetcher and a processing device communicatively coupled to the prefetcher. The processing device is configured to detect a throttling instruction that indicates a start of a throttling region. The computing device is further configured to prevent the prefetcher from being trained on one or more memory instructions included in the throttling region in response to the throttling instruction. Various other apparatuses, systems, and methods are also disclosed.

Abstract: A semiconductor package assembly includes a package interface. An interposer die has a first surface and a second surface opposite to the first surface, where the first surface of the interposer is die positioned on the package interface. The interposer die includes a plurality of conductive connections between the first surface and second surface. A chiplet includes a connectivity region having conductive pathways, with a first portion of the connectivity region coupled to a conductive connection of the interposer die and a second portion of the connectivity region cantilevered from the interposer die.

Abstract: Systems and methods for pushed prefetching include: multiple core complexes, each core complex having multiple cores and multiple caches, the multiple caches configured in a memory hierarchy with multiple levels; an interconnect device coupling the core complexes to each other and coupling the core complexes to shared memory, the shared memory at a lower level of the memory hierarchy than the multiple caches; and a push-based prefetcher having logic to: monitor memory traffic between caches of a first level of the memory hierarchy and the shared memory; and based on the monitoring, initiate a prefetch of data to a cache of the first level of the memory hierarchy.

Abstract: The disclosed computer-implemented method for interpolating register-based lookup tables can include identifying, within a set of registers, a lookup table that has been encoded for storage within the set of registers. The method can also include receiving a request to look up a value in the lookup table and responding to the request by interpolating, from the encoded lookup table stored in the set of registers, a representation of the requested value. Various other methods, systems, and computer-readable media are also disclosed.

Abstract: A data processing node includes a processor element and a data fabric circuit. The data fabric circuit is coupled to the processor element and to a local memory element and includes a crossbar switch. The data fabric circuit is operable to bypass the crossbar switch for memory access requests between the processor element and the local memory element.

Abstract: An electronic device includes a processor having processor circuitry and a leader memory controller, a controller coupled to the processor and having a follower memory controller, and a memory. The processor circuitry is operable to access the memory by issuing memory access requests to the leader memory controller. The leader memory controller is operable to complete the memory access requests using the follower memory controller to issue memory commands to the at least one memory die.