Patents by Inventor Gabriel Harley
Gabriel Harley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20200152813Abstract: Approaches for fabricating one-dimensional metallization for solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a back surface and an opposing light-receiving surface. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the back surface of the substrate and parallel along a first direction to form a one-dimensional layout of emitter regions for the solar cell. A conductive contact structure is disposed on the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal lines corresponding to the plurality of alternating N-type and P-type semiconductor regions. The plurality of metal lines is parallel along the first direction to form a one-dimensional layout of a metallization layer for the solar cell.Type: ApplicationFiled: January 13, 2020Publication date: May 14, 2020Inventors: Richard Hamilton Sewell, David Fredric Joel Kavulak, Lewis Abra, Thomas P. Pass, Taeseok Kim, Matthieu Moors, Benjamin Ian Hsia, Gabriel Harley
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Patent number: 10615296Abstract: Approaches for the foil-based metallization of solar cells and the resulting solar cells are described. In an example, a solar cell includes a substrate. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the substrate. A conductive contact structure is disposed above the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal seed material regions providing a metal seed material region disposed on each of the alternating N-type and P-type semiconductor regions. A metal foil is disposed on the plurality of metal seed material regions, the metal foil having anodized portions isolating metal regions of the metal foil corresponding to the alternating N-type and P-type semiconductor regions.Type: GrantFiled: August 30, 2018Date of Patent: April 7, 2020Assignees: SunPower Corporation, Total Marketing ServicesInventors: Gabriel Harley, Taeseok Kim, Richard Hamilton Sewell, Michael Morse, David D. Smith, Matthieu Moors, Jens-Dirk Moschner
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Patent number: 10608126Abstract: Contact holes of solar cells are formed by laser ablation to accommodate various solar cell designs. Use of a laser to form the contact holes is facilitated by replacing films formed on the diffusion regions with a film that has substantially uniform thickness. Contact holes may be formed to deep diffusion regions to increase the laser ablation process margins. The laser configuration may be tailored to form contact holes through dielectric films of varying thicknesses.Type: GrantFiled: October 26, 2017Date of Patent: March 31, 2020Assignee: SunPower CorporationInventors: Gabriel Harley, David D. Smith, Tim Dennis, Ann Waldhauer, Taeseok Kim, Peter John Cousins
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Patent number: 10608133Abstract: Solar cells having a plurality of sub-cells coupled by metallization structures, and singulation approaches to forming solar cells having a plurality of sub-cells coupled by metallization structures, are described. In an example, a solar cell, includes a plurality of sub-cells, each of the sub-cells having a singulated and physically separated semiconductor substrate portion. Adjacent ones of the singulated and physically separated semiconductor substrate portions have a groove there between. The solar cell also includes a monolithic metallization structure. A portion of the monolithic metallization structure couples ones of the plurality of sub-cells. The groove between adjacent ones of the singulated and physically separated semiconductor substrate portions exposes a portion of the monolithic metallization structure.Type: GrantFiled: December 28, 2017Date of Patent: March 31, 2020Assignee: SunPower CorporationInventors: Gabriel Harley, Michael Morse, Peter John Cousins
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Publication number: 20200091356Abstract: Approaches for foil-based metallization of solar cells and the resulting solar cells are described. For example, a method of fabricating a solar cell involves locating a metal foil above a plurality of alternating N-type and P-type semiconductor regions disposed in or above a substrate. The method also involves laser welding the metal foil to the alternating N-type and P-type semiconductor regions. The method also involves patterning the metal foil by laser ablating through at least a portion of the metal foil at regions in alignment with locations between the alternating N-type and P-type semiconductor regions. The laser welding and the patterning are performed at the same time.Type: ApplicationFiled: November 15, 2019Publication date: March 19, 2020Inventors: Taeseok Kim, Gabriel Harley, John Wade Viatella, Perine Jaffrennou
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Patent number: 10573763Abstract: Solar cells having a plurality of sub-cells coupled by metallization structures having a metal bridge, and singulation approaches to forming solar cells having a plurality of sub-cells coupled by metallization structures, are described. In an example, the metal bridge can provide structural support and provide for an electrical connection between a first contact pad and a first busbar. Adjacent ones of the singulated and physically separated semiconductor substrate portions have a groove there between and where the metal bridge can be perpendicular to the groove. The solar cell can include a first contact pad adjacent to a second contact pad.Type: GrantFiled: December 29, 2015Date of Patent: February 25, 2020Assignee: SunPower CorporationInventor: Gabriel Harley
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Patent number: 10535785Abstract: Approaches for foil-based metallization of solar cells and the resulting solar cells are described. For example, a method of fabricating a solar cell involves locating a metal foil above a plurality of alternating N-type and P-type semiconductor regions disposed in or above a substrate. The method also involves laser welding the metal foil to the alternating N-type and P-type semiconductor regions. The method also involves patterning the metal foil by laser ablating through at least a portion of the metal foil at regions in alignment with locations between the alternating N-type and P-type semiconductor regions. The laser welding and the patterning are performed at the same time.Type: GrantFiled: March 9, 2017Date of Patent: January 14, 2020Assignees: SunPower Corporation, Total Marketing ServicesInventors: Taeseok Kim, Gabriel Harley, John Wade Viatella, Perine Jaffrennou
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Patent number: 10535790Abstract: Approaches for fabricating one-dimensional metallization for solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a back surface and an opposing light-receiving surface. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the back surface of the substrate and parallel along a first direction to form a one-dimensional layout of emitter regions for the solar cell. A conductive contact structure is disposed on the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal lines corresponding to the plurality of alternating N-type and P-type semiconductor regions. The plurality of metal lines is parallel along the first direction to form a one-dimensional layout of a metallization layer for the solar cell.Type: GrantFiled: June 25, 2015Date of Patent: January 14, 2020Assignees: SunPower Corporation, Total Marketing ServicesInventors: Richard Hamilton Sewell, David Fredric Joel Kavulak, Lewis Abra, Thomas P. Pass, Taeseok Kim, Matthieu Moors, Benjamin Ian Hsia, Gabriel Harley
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Publication number: 20190267505Abstract: A method of fabricating a solar cell is disclosed. The method can include forming a dielectric region on a surface of a solar cell structure and forming a metal layer on the dielectric layer. The method can also include configuring a laser beam with a particular shape and directing the laser beam with the particular shape on the metal layer, where the particular shape allows a contact to be formed between the metal layer and the solar cell structure.Type: ApplicationFiled: May 9, 2019Publication date: August 29, 2019Inventors: Matthieu Moors, David D. Smith, Gabriel Harley, Taeseok Kim
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Publication number: 20190245099Abstract: The formation of solar cell contacts using a laser is described. A method of fabricating a back-contact solar cell includes forming a poly-crystalline material layer above a single-crystalline substrate. The method also includes forming a dielectric material stack above the poly-crystalline material layer. The method also includes forming, by laser ablation, a plurality of contacts holes in the dielectric material stack, each of the contact holes exposing a portion of the poly-crystalline material layer; and forming conductive contacts in the plurality of contact holes.Type: ApplicationFiled: February 14, 2019Publication date: August 8, 2019Applicant: SunPower CorporationInventors: Gabriel HARLEY, David D. SMITH, Peter John COUSINS
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Patent number: 10290758Abstract: A method of fabricating a solar cell is disclosed. The method can include forming a dielectric region on a surface of a solar cell structure and forming a metal layer on the dielectric layer. The method can also include configuring a laser beam with a particular shape and directing the laser beam with the particular shape on the metal layer, where the particular shape allows a contact to be formed between the metal layer and the solar cell structure.Type: GrantFiled: April 27, 2017Date of Patent: May 14, 2019Assignees: SunPower Corporation, Total Marketing ServicesInventors: Matthieu Moors, David D. Smith, Gabriel Harley, Taeseok Kim
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Patent number: 10211349Abstract: The formation of solar cell contacts using a laser is described. A method of fabricating a back-contact solar cell includes forming a poly-crystalline material layer above a single-crystalline substrate. The method also includes forming a dielectric material stack above the poly-crystalline material layer. The method also includes forming, by laser ablation, a plurality of contacts holes in the dielectric material stack, each of the contact holes exposing a portion of the poly-crystalline material layer; and forming conductive contacts in the plurality of contact holes.Type: GrantFiled: July 7, 2015Date of Patent: February 19, 2019Assignee: SunPower CorporationInventors: Gabriel Harley, David D. Smith, Peter John Cousins
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Patent number: 10199521Abstract: Approaches for the foil-based metallization of solar cells and the resulting solar cells are described. A method involves patterning a first surface of a metal foil to provide a plurality of alternating grooves and ridges in the metal foil. Non-conductive material regions are formed in the grooves in the metal foil. The metal foil is located above a plurality of alternating N-type and P-type semiconductor regions disposed in or above a substrate to provide the non-conductive material regions in alignment with locations between the alternating N-type and P-type semiconductor regions and to provide the ridges in alignment with the alternating N-type and P-type semiconductor regions. The ridges of the metal foil are adhered to the alternating N-type and P-type semiconductor regions. The metal foil is patterned through the metal foil from a second surface of the metal foil at regions in alignment with the non-conductive material regions.Type: GrantFiled: September 29, 2016Date of Patent: February 5, 2019Assignee: SunPower CorporationInventors: David Fredric Joel Kavulak, Gabriel Harley, Thomas P. Pass
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Publication number: 20190019900Abstract: Approaches for the foil-based metallization of solar cells and the resulting solar cells are described. In an example, a solar cell includes a substrate. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the substrate. A conductive contact structure is disposed above the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal seed material regions providing a metal seed material region disposed on each of the alternating N-type and P-type semiconductor regions. A metal foil is disposed on the plurality of metal seed material regions, the metal foil having anodized portions isolating metal regions of the metal foil corresponding to the alternating N-type and P-type semiconductor regions.Type: ApplicationFiled: August 30, 2018Publication date: January 17, 2019Inventors: Gabriel Harley, Taeseok Kim, Richard Hamilton Sewell, Michael Morse, David D. Smith, Matthieu Moors, Jens-Dirk Moschner
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Patent number: 10090421Abstract: Approaches for the foil-based metallization of solar cells and the resulting solar cells are described. In an example, a solar cell includes a substrate. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the substrate. A conductive contact structure is disposed above the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal seed material regions providing a metal seed material region disposed on each of the alternating N-type and P-type semiconductor regions. A metal foil is disposed on the plurality of metal seed material regions, the metal foil having anodized portions isolating metal regions of the metal foil corresponding to the alternating N-type and P-type semiconductor regions.Type: GrantFiled: April 12, 2017Date of Patent: October 2, 2018Assignees: SunPower Corporation, Total Marketing ServicesInventors: Gabriel Harley, Taeseok Kim, Richard Hamilton Sewell, Michael Morse, David D. Smith, Matthieu Moors, Jens-Dirk Moschner
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Publication number: 20180254360Abstract: Approaches for the metallization of solar cells and the resulting solar cells are described. In an example, a method of fabricating a solar cell involves forming a plurality of alternating N-type and P-type regions in or above a substrate. The method also involves forming a metal seed layer on the plurality of alternating N-type and P-type regions. The method also involves patterning at least a portion of the metal seed layer at regions in alignment with locations between the alternating N-type and P-type regions. The method also involves, subsequent to the patterning, etching to form trenches at the locations between the alternating N-type and P-type regions, isolating the alternating N-type and P-type regions from one another.Type: ApplicationFiled: April 16, 2018Publication date: September 6, 2018Inventors: GABRIEL HARLEY, SCOTT HARRINGTON, DAVID D. SMITH
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Patent number: 10032942Abstract: Methods of fabricating solar cells using a metal-containing thermal and diffusion barrier layer in foil-based metallization approaches, and the resulting solar cells, are described. For example, a method of fabricating a solar cell includes forming a plurality of semiconductor regions in or above a substrate. The method also includes forming a metal-containing thermal and diffusion barrier layer above the plurality of semiconductor regions. The method also includes forming a metal seed layer on the metal-containing thermal and diffusion barrier layer. The method also includes forming a metal conductor layer on the metal seed layer. The method also includes laser welding the metal conductor layer to the metal seed layer. The metal-containing thermal and diffusion barrier layer protects the plurality of semiconductor regions during the laser welding.Type: GrantFiled: April 20, 2017Date of Patent: July 24, 2018Assignees: SunPower Corporation, Total Marketing ServicesInventors: Taeseok Kim, Robert Woehl, Gabriel Harley, Nils-Peter Harder, Jens-Dirk Moschner, Matthieu Moors, Michel Arsene Olivier Ngamo Toko
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Publication number: 20180145194Abstract: Methods of fabricating a solar cell including metallization techniques and resulting solar cells, are described. In an example, a semiconductor region can be formed in or above a substrate. A first metal layer can be formed over the semiconductor region. A laser can be applied over a first region of the metal layer to form a first metal weld between the metal layer and the semiconductor region, where applying a laser over the first region comprises applying the laser at a first scanning speed. Subsequent to applying the laser over the first region, the laser can be applied over a second region of the metal layer where applying the laser over the second region includes applying a laser at a second scanning speed. Subsequent to applying the laser over the second region, the laser can be applied over a third region of the metal layer to form a second metal weld, where applying the laser over the third region comprises applying the laser at a third scanning speed.Type: ApplicationFiled: January 22, 2018Publication date: May 24, 2018Inventors: Matthieu Moors, Markus Nicht, Daniel Maria Weber, Rico Bohme, Mario Gjukic, Gabriel Harley, Mark Kleshock, Mohamed A. Elbandrawy, Taeseok Kim
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Publication number: 20180130920Abstract: Solar cells having a plurality of sub-cells coupled by metallization structures, and singulation approaches to forming solar cells having a plurality of sub-cells coupled by metallization structures, are described. In an example, a solar cell, includes a plurality of sub-cells, each of the sub-cells having a singulated and physically separated semiconductor substrate portion. Adjacent ones of the singulated and physically separated semiconductor substrate portions have a groove there between. The solar cell also includes a monolithic metallization structure. A portion of the monolithic metallization structure couples ones of the plurality of sub-cells. The groove between adjacent ones of the singulated and physically separated semiconductor substrate portions exposes a portion of the monolithic metallization structure.Type: ApplicationFiled: December 28, 2017Publication date: May 10, 2018Inventors: Gabriel Harley, Michael Morse, Peter John Cousins
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Patent number: 9947812Abstract: Approaches for the metallization of solar cells and the resulting solar cells are described. In an example, a method of fabricating a solar cell involves forming a plurality of alternating N-type and P-type regions in or above a substrate. The method also involves forming a metal seed layer on the plurality of alternating N-type and P-type regions. The method also involves patterning at least a portion of the metal seed layer at regions in alignment with locations between the alternating N-type and P-type regions. The method also involves, subsequent to the patterning, etching to form trenches at the locations between the alternating N-type and P-type regions, isolating the alternating N-type and P-type regions from one another.Type: GrantFiled: March 28, 2014Date of Patent: April 17, 2018Assignee: SunPower CorporationInventors: Gabriel Harley, Scott Harrington, David D. Smith