Abstract: Programmable I/O die devices and methods are described. An example system includes an input/output die (IOD) that couples a plurality of devices. The system also includes a programmable fabric included in the IOD. The programmable fabric implements interconnects for connecting the plurality of devices according to a reconfigurable topology defined by a configuration of the programmable fabric.

Abstract: Cache replacement policies are described. In accordance with the described techniques, a request for data is received and a cache replacement policy controls how a controller responds to the request. The cache replacement policy assigns each cacheline a priority value, which indicates whether the cacheline should be preserved relative to other cachelines, in response to the request being a cache miss that necessitates eviction of at least one cacheline. The cache replacement policy decrements priority values until at least one cacheline achieves a minimum priority value, at which point a cacheline is evicted. The cache replacement policy designates certain cachelines as protected, either via a separate protected indicator or via the cacheline's priority value, which causes unprotected cachelines to be selected for eviction while favoring preservation of protected cachelines in the cache.

Abstract: Multi-stack compute chip and memory architecture is described. In accordance with the described techniques, a package includes a plurality of computing stacks, and each computing stack includes at least one compute chip and a memory. The package also includes one or more interconnects that couple the computing stacks to at least one other computing stack for sharing the memory in a coherent fashion across the plurality of computing stacks.

Abstract: The disclosed semiconductor package includes a first chiplet area for receiving a first chiplet, a second chiplet area for receiving a second chiplet, and a host die coupled to the first and second chiplet areas. The semiconductor package also includes an interconnect directly coupling the first chiplet area to the second chiplet area. Various other methods, systems, and computer-readable media are also disclosed.